scispace - formally typeset
Journal ArticleDOI

A high-speed silicon optical modulator based on a metal–oxide–semiconductor capacitor

TLDR
An approach based on a metal–oxide–semiconductor (MOS) capacitor structure embedded in a silicon waveguide that can produce high-speed optical phase modulation is described and an all-silicon optical modulator with a modulation bandwidth exceeding 1 GHz is demonstrated.
Abstract
Silicon has long been the optimal material for electronics, but it is only relatively recently that it has been considered as a material option for photonics1. One of the key limitations for using silicon as a photonic material has been the relatively low speed of silicon optical modulators compared to those fabricated from III–V semiconductor compounds2,3,4,5,6 and/or electro-optic materials such as lithium niobate7,8,9. To date, the fastest silicon-waveguide-based optical modulator that has been demonstrated experimentally has a modulation frequency of only ∼20 MHz (refs 10, 11), although it has been predicted theoretically that a ∼1-GHz modulation frequency might be achievable in some device structures12,13. Here we describe an approach based on a metal–oxide–semiconductor (MOS) capacitor structure embedded in a silicon waveguide that can produce high-speed optical phase modulation: we demonstrate an all-silicon optical modulator with a modulation bandwidth exceeding 1 GHz. As this technology is compatible with conventional complementary MOS (CMOS) processing, monolithic integration of the silicon modulator with advanced electronics on a single silicon substrate becomes possible.

read more

Citations
More filters
Journal ArticleDOI

Four-wave mixing in silicon wire waveguides.

TL;DR: The observation of four-wave mixing phenomenon in a simple silicon wire waveguide at the optical powers normally employed in communications systems and the wavelength conversion for data rate of 10-Gbps using a 5.8-cm-long silicon wire is reported.
Journal ArticleDOI

Optical bistability on a silicon chip.

TL;DR: It is shown that the optical bistability allows all-optical functionalities, such as switching and memory with microsecond time response and a modulation depth of 10 dB, driven by pump power as low as 45 microW.
Journal ArticleDOI

Nanowire Photonic Circuit Elements

TL;DR: In this article, an approach for guiding and manipulating light on sub-wavelength scales using active nanowire waveguides and devices is presented. But the approach is limited to the case of light propagation.
Journal ArticleDOI

Hybrid Silicon Photonic Integrated Circuit Technology

TL;DR: In this paper, the current status of the hybrid silicon photonic integration platform with emphasis on its prospects for increased integration complexity is reviewed, and it is shown that this platform is well positioned and holds great potential to address future needs for medium-scale photonic integrated circuits.
Journal ArticleDOI

On-Chip Optical Interconnect Roadmap: Challenges and Critical Directions

TL;DR: The International Technology Roadmap for Semiconductors (ITRS) is used as a reference to explore the requirements that silicon-based ICs must satisfy to successfully outperform copper electrical interconnects (IEs).
References
More filters
Proceedings Article

Physics of semiconductor devices

S. M. Sze
Journal ArticleDOI

Electrooptical effects in silicon

TL;DR: In this article, a numerical Kramers-Kronig analysis is used to predict the refractive index perturbations produced in crystalline silicon by applied electric fields or by charge carriers.
Journal ArticleDOI

A review of lithium niobate modulators for fiber-optic communications systems

TL;DR: The lithium-niobate external-modulator technology meets the performance and reliability requirements of current 2.5-, 10-Gb/s digital communication systems, as well as CATV analog systems, and multiple high-speed modulation functions have been achieved in a single device.
Journal ArticleDOI

Silicon-based optoelectronics

TL;DR: In this article, a review of Si-based photonic components and optoelectronic integration techniques, both hybrid and monolithic, is presented, with a focus on column IV materials (Si, Ge, C and Sn).
Related Papers (5)