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Journal ArticleDOI

Multiple-gate SOI MOSFETs

Jean-Pierre Colinge
- 01 Jun 2004 - 
- Vol. 48, Iss: 6, pp 897-905
TLDR
In this paper, the authors describe the evolution and properties of a new class of MOSFETs, called triple-plus (3 + )-gate devices, which offer a practical solution to the problem of the ultimate, yet manufacturable, silicon MOS-FET.
Abstract
In an ever increasing need for higher current drive and better short-channel characteristics, silicon-on-insulator MOS transistors are evolving from classical, planar, single-gate devices into three-dimensional devices with multiple gates (double-, triple- or quadruple-gate devices). The evolution and the properties of such devices are described and the emergence of a new class of MOSFETs, called triple-plus (3 + )-gate devices offer a practical solution to the problem of the ultimate, yet manufacturable, silicon MOSFET.

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Citations
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Electronics and optoelectronics of two-dimensional transition metal dichalcogenides.

TL;DR: This work reviews the historical development of Transition metal dichalcogenides, methods for preparing atomically thin layers, their electronic and optical properties, and prospects for future advances in electronics and optoelectronics.
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Fundamentals of Modern VLSI Devices

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TL;DR: In this article, the authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices.
Journal ArticleDOI

Two-dimensional semiconductors for transistors

TL;DR: In this article, a mathematical framework to evaluate the performance of FETs and describe the challenges for improving the performances of short-channel FET in relation to the properties of 2D materials, including graphene, transition metal dichalcogenides, phosphorene and silicene.
Journal ArticleDOI

Multigate transistors as the future of classical metal–oxide–semiconductor field-effect transistors

TL;DR: In the current generation of transistors, the transistor dimensions have shrunk to such an extent that the electrical characteristics of the device can be markedly degraded, making it unlikely that the exponential decrease in transistor size can continue.
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Performance estimation of junctionless multigate transistors

TL;DR: In this paper, the authors describe the simulation of the electrical characteristics of a new transistor concept called the junctionless multigate field effect transistor (MuGFET), which has no junctions, a simpler fabrication process, less variability and better electrical properties than classical inversionmode devices with PN junctions at the source and drain.
References
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Journal ArticleDOI

Scaling the Si MOSFET: from bulk to SOI to bulk

TL;DR: In this article, the scaling of fully depleted SOI devices is considered and the concept of controlling horizontal leakage through vertical structures is highlighted, and several structural variations of conventional SOI structures are discussed in terms of a natural length scale to guide the design.
Journal ArticleDOI

Double-gate silicon-on-insulator transistor with volume inversion: A new device with greatly enhanced performance

TL;DR: The double-gate control of silicon-on-insulator (SOI) transistors is used to force the whole silicon film (interface layers and volume) in strong inversion as discussed by the authors.
Journal ArticleDOI

Scaling theory for cylindrical, fully-depleted, surrounding-gate MOSFET's

TL;DR: In this paper, a scaling theory for fully-depleted, cylindrical MOSFET's was presented. But the scaling theory was derived from the cylinrical form of Poisson's equation by assuming a parabolic potential in the radial direction.
Journal ArticleDOI

Scaling theory for double-gate SOI MOSFET's

TL;DR: In this paper, a scaling theory for double-gate SOI MOSFETs is presented, which gives guidance for device design that maintains a sub-threshold factor for a given gate length.
Journal ArticleDOI

High performance fully-depleted tri-gate CMOS transistors

TL;DR: Fully depleted tri-gate CMOS transistors with 60 nm physical gate lengths on SOI substrates have been fabricated in this article, where the transistors show near-ideal subthreshold gradient and excellent DIBL behavior, and have drive current characteristics greater than any non-planar devices reported so far, for correctly-targeted threshold voltages.
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