IBM

About: IBM is a company organization based out in Armonk, New York, United States. It is known for research contribution in the topics: Layer (electronics) & Signal. The organization has 134567 authors who have published 253905 publications receiving 7458795 citations. The organization is also known as: International Business Machines Corporation & Big Blue.

Directed-Graph Epidemiological Models of Computer viruses.

Abstract: The strong analogy between biological viruses and their computational counterparts has motivated the authors to adapt the techniques of mathematical epidemiology to the study of computer virus propagation In order to allow for the most general patterns of program sharing, a standard epidemiological model is extended by placing it on a directed graph and a combination of analysis and simulation is used to study its behavior The conditions under which epidemics are likely to occur are determined, and, in cases where they do, the dynamics of the expected number of infected individuals are examined as a function of time It is concluded that an imperfect defense against computer viruses can still be highly effective in preventing their widespread proliferation, provided that the infection rate does not exceed a well-defined critical epidemic threshold >

Mining Process Models from Workflow Logs

Abstract: Modern enterprises increasingly use the workflow paradigm to prescribe how business processes should be performed. Processes are typically modeled as annotated activity graphs. We present an approach for a system that constructs process models from logs of past, unstructured executions of the given process. The graph so produced conforms to the dependencies and past executions present in the log. By providing models that capture the previous executions of the process, this technique allows easier introduction of a workflow system and evaluation and evolution of existing process models. We also present results from applying the algorithm to synthetic data sets as well as process logs obtained from an IBM Flowmark installation.

Four-party credit/debit payment protocol

Abstract: A method, system, program, and method of doing business are disclosed for electronic commerce that includes the feature of a “thin” consumer's wallet by providing issuers with an active role in each payment. This is achieved by adding an issuer gateway and moving the credit/debit card authorization function from the merchant to the issuer. This enables an issuer to independently choose alternate authentication mechanisms without changing the acquirer gateway. It also results in a significant reduction in complexity, thereby improving the ease of implementation and overall performance.

Trojan Detection using IC Fingerprinting

Abstract: Hardware manufacturers are increasingly outsourcing their IC fabrication work overseas due to their much lower cost structure. This poses a significant security risk for ICs used for critical military and business applications. Attackers can exploit this loss of control to substitute Trojan ICs for genuine ones or insert a Trojan circuit into the design or mask used for fabrication. We show that a technique borrowed from side-channel cryptanalysis can be used to mitigate this problem. Our approach uses noise modeling to construct a set of fingerprints/or an IC family utilizing side- channel information such as power, temperature, and electromagnetic (EM) profiles. The set of fingerprints can be developed using a few ICs from a batch and only these ICs would have to be invasively tested to ensure that they were all authentic. The remaining ICs are verified using statistical tests against the fingerprints. We describe the theoretical framework and present preliminary experimental results to show that this approach is viable by presenting results obtained by using power simulations performed on representative circuits with several different Trojan circuitry. These results show that Trojans that are 3-4 orders of magnitude smaller than the main circuit can be detected by signal processing techniques. While scaling our technique to detect even smaller Trojans in complex ICs with tens or hundreds of millions of transistors would require certain modifications to the IC design process, our results provide a starting point to address this important problem.

Three-dimensional integrated circuits

Abstract: Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They also provide for microchip architecture and may facilitate the integration of heterogeneous materials, devices, and signals. However, before these advantages can be realized, key technology challenges of 3D ICs must be addressed. More specifically, the processes required to build circuits with multiple layers of active devices must be compatible with current state-of-the-art silicon processing technology. These processes must also show manufacturability, i.e., reliability, good yield, maturity, and reasonable cost. To meet these requirements, IBM has introduced a scheme for building 3D ICs based on the layer transfer of functional circuits, and many process and design innovations have been implemented. This paper reviews the process steps and design aspects that were developed at IBM to enable the formation of stacked device layers. Details regarding an optimized layer transfer process are presented, including the descriptions of 1) a glass substrate process to enable through-wafer alignment; 2) oxide fusion bonding and wafer bow compensation methods for improved alignment tolerance during bonding; 3) and a single-damascene patterning and metallization method for the creation of high-aspect-ratio (6:1 108 vias/cm2), and extremely aggressive wafer-to-wafer alignment (submicron) capability.