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A physically based mobility model for numerical simulation of nonplanar devices

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TLDR
A local mobility function, set up in terms of a simple Mattiessen's rule, provides a careful description of MOSFET operation in a wide range of normal (or gate) electric fields.
Abstract
A semiempirical model for carrier mobility in silicon inversion layers is presented. The model, strongly oriented to CAD (computer-aided design) applications, is suitable for two-dimensional numerical simulations of nonplanar devices. A local mobility function, set up in terms of a simple Mattiessen's rule, provides a careful description of MOSFET operation in a wide range of normal (or gate) electric fields, channel impurity concentrations of between 5*10/sup 14/ cm/sup -3/ and 10/sup 17/ cm/sup -3/ for the acceptor density of states and 6*10/sup 14/ cm/sup -3/ and 3*10/sup 17/ cm/sup -3/ for the donor density of states; and temperatures between 200 K and 460 K. Best-fit model parameters are extracted by comparing the calculated drain conductance with a very large set of experimental data points. >

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Citations
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Journal ArticleDOI

Analytical Model for the Surrounded Field Plate in Folded Lateral MOSFET Structure

TL;DR: In this paper , a unified analytical model concerning the surrounded plate field is proposed for extended drain MOSFETs (EDMOS) in order to predict the breakdown voltage (BV) for different SFP lengths and dielectric parameters.
Journal ArticleDOI

An Analytic Model for Electron Mobility in Strained Si/Si1-xGex nMOSFETs

TL;DR: In this paper, a new analytical electron mobility model was proposed to describe electron transport properties in inversion layer of strained Si/Si1-xGex nMOSFETs.

A Temperature-Dependent dVCE/dt Model for Field-Stop IGBT at Turn-Off Transient

TL;DR: In this article , an analytical model is proposed to model collector-emitter voltage rising slope of field-stop insulated gate bipolar transistor (FS IGBT) during the turn-off transient.
Proceedings ArticleDOI

Optimization of Multiple Physical Phenomena through a Universal Metric in Junctionless Transistors

TL;DR: The work reports on the identification and applicability of a universal metric to suppress gate induced off-state tunneling while preserving impact ionization triggered sub-60 mV/decade current transition and hysteresis in 25 nm Junctionless (JL) MOSFET.
References
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Book

Analysis and simulation of semiconductor devices

TL;DR: The history of numerical device modeling can be traced back to the early 1970s as mentioned in this paper, when the basic Semiconductor Equations were defined and the goal of modeling was to identify the most fundamental properties of numerical devices.
Journal ArticleDOI

A review of some charge transport properties of silicon

TL;DR: In this article, the present knowledge of charge transport properties in silicon, with special emphasis on their application in the design of solid-state devices, is reviewed, and most attention is devoted to experimental findings in the temperature range around 300 K and to high-field properties.
Journal ArticleDOI

Self-Consistent Results for n -Type Si Inversion Layers

Frank Stern
- 15 Jun 1972 - 
TL;DR: In this article, self-consistent results for energy levels, populations, and charge distributions are given for $n$-type inversion layers on $p$ -type silicon.
Journal ArticleDOI

Modeling of carrier mobility against carrier concentration in arsenic-, phosphorus-, and boron-doped silicon

TL;DR: In this article, the electron mobility data for both arsenic-and boron-doped silicon are presented in the high doping range, and it is shown that electron mobility is significantly lower in As-and Boron-Doped silicon for carrier concentrations higher than 1019cm-3.
Journal ArticleDOI

Electron mobility in inversion and accumulation layers on thermally oxidized silicon surfaces

TL;DR: In this paper, an extensive set of experimental results on the behavior of electron surface mobility in thermally oxidized silicon structures are presented, which allow the calculation of electron mobility under a wide variety of substrate, process, and electrical conditions.
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