Showing papers on "Gallium nitride published in 2014"

GaN Transistors for Efficient Power Conversion

Abstract: This timely second edition has been substantially expanded to keep students and practicing power conversion engineers ahead of the learning curve in GaN technology advancements. Acknowledging that GaN transistors are not one-to-one replacements for the current MOSFET technology, this book serves as a practical guide for understanding basic GaN transistor construction, characteristics, and applications. Included are discussions on the fundamental physics of these power semiconductors, layout and other circuit design considerations, as well as specific application examples demonstrating design techniques when employing GaN devices.

Evaluation and Application of 600 V GaN HEMT in Cascode Structure

Abstract: Gallium nitride high electron mobility transistor (GaN HEMT) has matured dramatically over the last few years. A progressively larger number of GaN devices have been manufactured for in field applications ranging from low power voltage regulators to high power infrastructure base-stations. Compared to the state-of-the-art silicon MOSFET, GaN HEMT has a much better figure of merit and shows potential for high-frequency applications. The first generation of 600 V GaN HEMT is intrinsically normally on device. To easily apply normally on GaN HEMT in circuit design, a low-voltage silicon MOSFET is in series to drive the GaN HEMT, which is well known as cascode structure. This paper studies the characteristics and operation principles of a 600 V cascode GaN HEMT. Evaluations of the cascode GaN HEMT performance based on buck converter at hard-switching and soft-switching conditions are presented in detail. Experimental results prove that the cascode GaN HEMT is superior to the silicon MOSFET, but it still needs soft-switching in high-frequency operation due to considerable package and layout parasitic inductors and capacitors. The cascode GaN HEMT is then applied to a 1 MHz 300 W 400 V/12 V LLC converter. A comparison of experimental results with a state-of-the-art silicon MOSFET is provided to validate the advantages of the GaN HEMT.

Tuning the surface Fermi level on p-type gallium nitride nanowires for efficient overall water splitting

Abstract: Solar water splitting is one of the key steps in artificial photosynthesis for future carbon-neutral, storable and sustainable source of energy. Here we show that one of the major obstacles for achieving efficient and stable overall water splitting over the emerging nanostructured photocatalyst is directly related to the uncontrolled surface charge properties. By tuning the Fermi level on the nonpolar surfaces of gallium nitride nanowire arrays, we demonstrate that the quantum efficiency can be enhanced by more than two orders of magnitude. The internal quantum efficiency and activity on p-type gallium nitride nanowires can reach ~51% and ~4.0 mol hydrogen h(-1) g(-1), respectively. The nanowires remain virtually unchanged after over 50,000 μmol gas (hydrogen and oxygen) is produced, which is more than 10,000 times the amount of photocatalyst itself (~4.6 μmol). The essential role of Fermi-level tuning in balancing redox reactions and in enhancing the efficiency and stability is also elucidated.

Investigations of 600-V GaN HEMT and GaN Diode for Power Converter Applications

Abstract: Power switching devices based on wide bandgap semiconductor materials, such as silicon carbide (SiC) and gallium nitride (GaN) offer superior performance such as low switching and conduction losses, high voltage, high frequency, and high temperature operation. In this paper, a 600-V GaN switch and a 600-V GaN diode were tested in detail to understand the GaN device capabilities with respect to equivalent silicon-based devices such as IGBT and MOSFET. Detailed experimental loss models are developed and compared with datasheet models. Experimental setup of different power converters such as boost, buck-boost, and half-bridge inverter and associated comparative experimental results are presented. This paper also presents the investigations into the effectiveness of using GaN devices and higher switching frequencies in reducing the total size and cost of power conversion equipment such as an online UPS system.

Gallium Nitride as an Electromechanical Material

Abstract: Gallium nitride (GaN) is a wide bandgap semiconductor material and is the most popular material after silicon in the semiconductor industry. The prime movers behind this trend are LEDs, microwave, and more recently, power electronics. New areas of research also include spintronics and nanoribbon transistors, which leverage some of the unique properties of GaN. GaN has electron mobility comparable with silicon, but with a bandgap that is three times larger, making it an excellent candidate for high-power applications and high-temperature operation. The ability to form thin-AlGaN/GaN heterostructures, which exhibit the 2-D electron gas phenomenon leads to high-electron mobility transistors, which exhibit high Johnson's figure of merit. Another interesting direction for GaN research, which is largely unexplored, is GaN-based micromechanical devices or GaN microelectromechanical systems (MEMS). To fully unlock the potential of GaN and realize new advanced all-GaN integrated circuits, it is essential to cointegrate passive devices (such as resonators and filters), sensors (such as temperature and gas sensors), and other more than Moore functional devices with GaN active electronics. Therefore, there is a growing interest in the use of GaN as a mechanical material. This paper reviews the electromechanical, thermal, acoustic, and piezoelectric properties of GaN, and describes the working principle of some of the reported high-performance GaN-based microelectromechanical components. It also provides an outlook for possible research directions in GaN MEMS.

GaN-on-Si Vertical Schottky and p-n Diodes

Abstract: This letter demonstrates GaN vertical Schottky and p-n diodes on Si substrates for the first time. With a total GaN drift layer of only 1.5- $\mu{\rm m}$ thick, a breakdown voltage (BV) of 205 V was achieved for GaN-on-Si Schottky diodes, and a soft BV higher than 300 V was achieved for GaN-on-Si p-n diodes with a peak electric field of 2.9 MV/cm in GaN. A trap-assisted space-charge-limited conduction mechanism determined the reverse leakage and breakdown mechanism for GaN-on-Si vertical p-n diodes. The on-resistance was 6 and 10 ${\rm m}\Omega\cdot{\rm cm}^{2}$ for the vertical Schottky and p-n diode, respectively. These results show the promising performance of GaN-on-Si vertical devices for future power applications.

High-Frequency PWM Buck Converters Using GaN-on-SiC HEMTs

Abstract: GaN high electron mobility transistors (HEMTs) are well suited for high-frequency operation due to their lower on resistance and device capacitance compared with traditional silicon devices. When grown on silicon carbide, GaN HEMTs can also achieve very high power density due to the enhanced power handling capabilities of the substrate. As a result, GaN-on-SiC HEMTs are increasingly popular in radio-frequency power amplifiers, and applications as switches in high-frequency power electronics are of high interest. This paper explores the use of GaN-on-SiC HEMTs in conventional pulse-width modulated switched-mode power converters targeting switching frequencies in the tens of megahertz range. Device sizing and efficiency limits of this technology are analyzed, and design principles and guidelines are given to exploit the capabilities of the devices. The results are presented for discrete-device and integrated implementations of a synchronous Buck converter, providing more than 10-W output power supplied from up to 40 V with efficiencies greater than 95% when operated at 10 MHz, and greater than 90% at switching frequencies up to 40 MHz. As a practical application of this technology, the converter is used to accurately track a 3-MHz bandwidth communication envelope signal with 92% efficiency.

Light emitting devices having dislocation density maintaining buffer layers

Abstract: A method for forming a light emitting device comprises forming a buffer layer having a plurality of layers comprising a substrate, an aluminum gallium nitride layer adjacent to the substrate, and a gallium nitride layer adjacent to the aluminum gallium nitride layer. During the formation of each of the plurality of layers, one or more process parameters are selected such that an individual layer of the plurality of layers is strained.

Buffer Traps in Fe-Doped AlGaN/GaN HEMTs: Investigation of the Physical Properties Based on Pulsed and Transient Measurements

Abstract: This paper presents an extensive investigation of the properties of the trap with activation energy equal to 0.6 eV, which has been demonstrated to be responsible for current collapse (CC) in AlGaN/GaN HEMTs. The study was carried out on AlGaN/GaN HEMTs with increasing concentration of iron doping in the buffer. Based on pulsed characterization and drain current transient measurements, we demonstrate that for the samples under investigation: 1) increasing concentrations of Fe-doping in the buffer may induce a strong CC, which is related to the existence of a trap level located 0.63 eV below the conduction band energy and 2) this trap is physically located in the buffer layer, and is not related to the iron atoms but—more likely—to an intrinsic defect whose concentration depends on buffer doping. Moreover, we demonstrate that this level can be filled both under OFF-state conditions (by gate-leakage current) and under ON-state operation (when hot electrons can be injected to the buffer): for these reasons, it can significantly affect the switching properties of AlGaN/GaN HEMTs.

SiC and GaN devices – wide bandgap is not all the same

Abstract: Silicon carbide (SiC)-diodes have been commercially available since 2001 and various SiC-switches have been launched recently. Parallelly, gallium nitride (GaN) is moving into power electronics and the first low-voltage devices are already on the market. Currently, it seems that GaN-transistors are ideal for high frequency ICs up to 1kV (maybe 2kV) and maximum a few 10A. SiC transistors are better suited for discrete devices or modules blocking 1kV and above and virtually no limit in the current but in that range they will face strong competition from the silicon insulated gate bipolar transistors (IGBTs). SiC and GaN Schottky-diodes would offer a similar performance, hence here it becomes apparent that material cost and quality will finally decide the commercial success of wide bandgap devices. Bulk GaN is still prohibitively expensive, whereas GaN on silicon would offer an unrivalled cost advantage. Devices made from the latter could be even cheaper than silicon devices. However, packaging is already a limiting factor for silicon devices even more so in exploiting the advantage of wide bandgap materials with respect to switching speed and high temperature operation. After all, reliability is a must for any device no matter which material it is made of.

Formation of heteroepitaxial layers with rapid thermal processing to remove lattice dislocations

Abstract: Method and devices are disclosed for device manufacture of gallium nitride devices by growing a gallium nitride layer on a silicon substrate using Atomic Layer Deposition (ALD) followed by rapid thermal annealing. Gallium nitride is grown directly on silicon or on a barrier layer of aluminum nitride grown on the silicon substrate. One or both layers are thermally processed by rapid thermal annealing. Preferably the ALD process use a reaction temperature below 550° C. and preferable below 350° C. The rapid thermal annealing step raises the temperature of the coating surface to a temperature ranging from 550 to 1500° C. for less than 12 msec.

Enhancement-Mode GaN-Based High-Electron Mobility Transistors on the Si Substrate With a P-Type GaN Cap Layer

Abstract: An enhancement-mode (E-mode) high-electron mobility transistor (HEMT) was demonstrated by inserting a p-type GaN layer underneath the gate electrode. The effects of process flows and device structures on the electrical properties are investigated in this paper. We demonstrated a threshold voltage (Vth) of 4.3 V by adjusting the built-in voltage of the diode formed between the p-GaN and channel by the alloy temperature. Next, we found the existence of parallel conduction paths of the p-GaN layer and 2-D electron gas (2DEG) channel in such a HEMT structure. By removing p-GaN above the gate-source and gate-drain regions, current conduction migrates from p-GaN to 2DEG channel. The process window of the p-GaN residual thickness to ensure a steady forward current-voltage operation was estimated to be 10±5 nm in our case. Finally, with the p-GaN underneath the gate contact to deplete surface leakage current, an E-mode HEMT with a breakdown voltage (VBD) of 1630 V is achieved.

Challenges for energy efficient wide band gap semiconductor power devices

Abstract: Wide band gap semiconductors, and in particular silicon carbide (4H-SiC) and gallium nitride (GaN), are very promising materials for the next generation of power electronics, to guarantee an improved energy efficiency of devices and modules. As a matter of fact, in the last decade intensive academic and industrial research efforts have resulted in the demonstration of both 4H-SiC MOSFETs and GaN HEMTs exhibiting VB2/Ron performances well beyond the silicon limits. In this paper, some of the present scientific challenges for SiC and GaN power devices technology are reviewed. In particular, the topics selected in this work will be the SiO2/SiC interface passivation processes to improve the channel mobility in 4H-SiC MOSFETs, the current trends for gate dielectrics in GaN technology and the viable routes to obtain normally-off HEMTs.

Gate drive design considerations for high voltage cascode GaN HEMT

Abstract: This paper investigates gate drive design for high voltage gallium nitride (GaN) high electron-mobility transistors (HEMT) in a cascade structure. High dv/dt and di/dt switching characteristics of GaN device and its influences on high-side gate drive are analyzed on an 8.4kW bidirectional multi-channel buck/boost battery charger operating in critical conduction mode (CRM). Driving candidates for high-side gate drive are reviewed, and digital isolator based driving architecture is proposed with discussion of PCB layout and package parasitics. Experimental results are conducted in each step for concepts validation.

Kinetics of Buffer-Related R ON -Increase in GaN-on-Silicon MIS-HEMTs

Abstract: This letter reports an extensive analysis of the charge capture transients induced by OFF-state bias in double heterostructure AlGaN/GaN MIS- high electron mobility transistor grown on silicon substrate The exposure to OFF-state bias induces a significant increase in the ON-resistance (R on ) of the devices Thanks to time-resolved on-the-fly analysis of the trapping kinetics, we demonstrate the following relevant results: 1) R on -increase is temperature- and field-dependent, hence can significantly limit the dynamic performance of the devices at relatively high-voltage and high temperature (100 °C-140 °C) operative conditions; 2) the comparison between OFF-state and back-gating stress indicates that the major contribution to the R on -increase is due to the trapping of electrons in the buffer, and not at the surface; 3) the observed exponential kinetics suggests the involvement of point-defects, featuring thermally activated capture cross section; and 4) trapping-rate is correlated with buffer vertical leakage-current and is almost independent to gate-drain length

Evaluation of gallium nitride transistors in high frequency resonant and soft-switching DC-DC converters

Abstract: The emergence of gallium nitride (GaN) based power devices offers the potential to achieve higher efficiencies and higher switching frequencies than possible with aging silicon (Si) power MOSFETs. In this paper, we will evaluate the ability of gallium nitride transistors to improve efficiency and output power density in high frequency resonant and soft-switching applications. To experimentally verify the benefits of replacing Si MOSFETs with enhancement mode GaN transistors (eGaN®FETs) in a high frequency resonant converter, 48 V to 12 V unregulated isolated bus converter prototypes operating at a switching frequency of 1.2 MHz and an output power of up to 400W are compared using Si and GaN power devices.

Interface Charge Engineering for Enhancement-Mode GaN MISHEMTs

Abstract: We demonstrate an efficient approach to engineer the dielectric/AlGaN positive interface fixed charges by oxygen plasma and post-metallization anneal. Significant suppression of interface fixed charges from 2 × 1013 to 8 × 1012 cm-2 was observed. Experimental and theoretical electron mobility characteristics and the impact of remote impurity scattering were investigated. The reduction in oxide/semiconductor interface charge density leads to an increase of electron mobility, and enables a positive threshold voltage.

Trapping and Reliability Assessment in D-Mode GaN-Based MIS-HEMTs for Power Applications

Abstract: This paper reports on an extensive analysis of the trapping processes and of the reliability of experimental AlGaN/GaN MIS-HEMTs, grown on silicon substrate. The study is based on combined pulsed characterization, transient investigation, breakdown, and reverse-bias stress tests, and provides the following, relevant, information: 1) the exposure to high gate-drain reverse-bias may result in a recoverable increase in the on-resistance (RON), and in a slight shift in threshold voltage; 2) devices with a longer gate-drain distance show a stronger increase in RON, compared to smaller devices; 3)current transient measurements indicate the existence of one trap level, with activation energy of 1.03 ± 0.09 eV; and 4) we demonstrate that through the improvement of the fabrication process, it is possible to design devices with negligible trapping. Furthermore, the degradation of the samples was studied by means of step-stress experiments in off-state. Results indicate that exposure to moderate-high reverse bias (<; 250 V for LGD = 2 μm) does not induce any measurable degradation, thus confirming the high reliability of the analyzed samples. A permanent degradation is detected only for very high reverse voltages (typically, VDS = 260-265 V, on a device with LGD = 2 μm stressed with VGS = - 8 V) and consists of a rapid increase in gate leakage current, followed by a catastrophic failure. EL measurements and microscopy investigation revealed that degradation occurs close to the gate, in proximity of the sharp edges of the drain contacts, i.e., in a region where the electric field is maximum.

Wide bandgap III-nitride nanomembranes for optoelectronic applications

Abstract: Single crystalline nanomembranes (NMs) represent a new embodiment of semiconductors having a two-dimensional flexural character with comparable crystalline perfection and optoelectronic efficacy. In this Letter, we demonstrate the preparation of GaN NMs with a freestanding thickness between 90 to 300 nm. Large-area (>5 × 5 mm2) GaN NMs can be routinely obtained using a procedure of conductivity-selective electrochemical etching. GaN NM is atomically flat and possesses an optical quality similar to that from bulk GaN. A light-emitting optical heterostructure NM consisting of p-GaN/InGaN quantum wells/GaN is prepared by epitaxy, undercutting etching, and layer transfer. Bright blue light emission from this heterostructure validates the concept of NM-based optoelectronics and points to potentials in flexible applications and heterogeneous integration.

A Double-Pulse Technique for the Dynamic I/V Characterization of GaN FETs

Abstract: Standard dynamic characterization methods based on periodic narrow-pulse low duty-cycle excitation waveforms provide suboptimal I/V curves when used along with GaN field effect transistors (FETs), due to complex nonlinear charge trapping effects. Thus, a double-pulse technique for the dynamic characterization of GaN FETs is here presented. The double-pulsed I/V characteristics are shown to be not only isothermal but also corresponding to a fixed charge trapping state.

Evaluation of high-voltage cascode GaN HEMT in different packages

Abstract: This paper presents the evaluation of high-voltage cascode gallium nitride (GaN) high-electron-mobility transistors (HEMT) in different packages. The high-voltage cascode GaN HEMT in traditional package has high turn-on loss in hard-switching turn-on condition, and severe internal parasitic ringing, which could possibly damage the gate of GaN HEMT, in hard-switching turn-off condition, due to package parasitics. To solve these problems a stack-die package is introduced, which is able to eliminate all the critical common-source inductors in traditional package, avoiding side effects caused by the package, and thus could be more suitable for MHz high frequency operation. A prototype of this stack-die package is fabricated in the lab, experimental results are shown to verify the analysis and to demonstrate the strength of the stack-die package.

Surface band bending and band alignment of plasma enhanced atomic layer deposited dielectrics on Ga- and N-face gallium nitride

Abstract: The effects of surface pretreatment, dielectric growth, and post deposition annealing on interface electronic structure and polarization charge compensation of Ga- and N-face bulk GaN were investigated. The cleaning process consisted of an ex-situ wet chemical NH4OH treatment and an in-situ elevated temperature NH3 plasma process to remove carbon contamination, reduce oxygen coverage, and potentially passivate N-vacancy related defects. After the cleaning process, carbon contamination decreased below the x-ray photoemission spectroscopy detection limit, and the oxygen coverage stabilized at ∼1 monolayer on both Ga- and N-face GaN. In addition, Ga- and N-face GaN had an upward band bending of 0.8 ± 0.1 eV and 0.6 ± 0.1 eV, respectively, which suggested the net charge of the surface states and polarization bound charge was similar on Ga- and N-face GaN. Furthermore, three dielectrics (HfO2, Al2O3, and SiO2) were prepared by plasma-enhanced atomic layer deposition on Ga- or N-face GaN and annealed in N2 ambient to investigate the effect of the polarization charge on the interface electronic structure and band offsets. The respective valence band offsets of HfO2, Al2O3, and SiO2 with respect to Ga- and N-face GaN were 1.4 ± 0.1, 2.0 ± 0.1, and 3.2 ± 0.1 eV, regardless of dielectric thickness. The corresponding conduction band offsets were 1.0 ± 0.1, 1.3 ± 0.1, and 2.3 ± 0.1 eV, respectively. Experimental band offset results were consistent with theoretical calculations based on the charge neutrality level model. The trend of band offsets for dielectric/GaN interfaces was related to the band gap and/or the electronic part of the dielectric constant. The effect of polarization charge on band offset was apparently screened by the dielectric-GaN interface states.

Numerical Analysis of Breakdown Voltage Enhancement in AlGaN/GaN HEMTs With a High- $k$ Passivation Layer

Abstract: 2-D analysis of breakdown characteristics in AlGaN/GaN high electron mobility transistors (HEMTs) is performed by considering a deep donor and a deep acceptor in a buffer layer. The dependence of the OFF-state breakdown voltage on the relative permittivity of the passivation layer er and the thickness of the passivation layer d are studied. It is shown that as er increases, the OFF-state breakdown voltage increases. This is because the electric field at the drain edge of the gate is weakened as er increases. This occurs because in the insulator the applied voltage tends to drop uniformly in general, and hence when the insulator is attached to the semiconductor, the voltage drop along the semiconductor becomes smoother at the drain edge of the gate if the er of the insulator is higher. It is also shown that the OFF-state breakdown voltage increases as d increases because the electric field at the drain edge of the gate is weakened as d increases. It is concluded that AlGaN/GaN HEMTs with a high- k and thick passivation layer should have high breakdown voltages.

Improvement of $V_{\rm th}$ Instability in Normally-Off GaN MIS-HEMTs Employing ${\rm PEALD}\hbox{-}{\rm SiN}_{\rm x}$ as an Interfacial Layer

Abstract: In this letter, reduction of threshold voltage instability in gate recessed normally-off GaN metal insulator semiconductor high electron mobility transistors with SiNx gate insulator was investigated. A plasma enhanced atomic layer deposition technique was successfully employed for very thin SiNx (5 nm) as an interfacial layer. The hysteresis and drift of threshold voltage in transfer curve and the forward biased gate leakage current were effectively reduced.

Application of wide bandgap devices in renewable energy systems — Benefits and challenges

Abstract: The rapid development of renewable energy systems (RES), especially photovoltaic (PV) energy and wind energy, poses increasing requirements for highpower, low-loss, fast-switching, and reliable semiconductor devices to improve system power capacity, efficiency, power density and reliability. The recent commercialization of wide bandgap (WBG) devices, specifically Silicon Carbide (SiC) and Gallium Nitride (GaN) devices, provides very promising opportunities for meeting such requirements with their attractive features of high voltage blocking capability, ultra-low switching losses, fast switching speed, and high allowable operating temperatures. This paper analyzed the performance benefits and application challenges of using SiC or GaN devices in both PV and wind energy conversion systems. Solutions to these challenges of using WBG devices in various RES were reviewed and proposed, and the benefits of using such emerging devices were confirmed in simulation based on a 250 kW commercial-scale PV inverter and a 250 kW doubly fed induction generator wind turbine system.

Uncooled Infrared Detectors Using Gallium Nitride on Silicon Micromechanical Resonators

Abstract: This paper presents the analysis, design, fabrication, and the first measured results demonstrating the use of gallium nitride (GaN)-based micromechanical resonator arrays as high-sensitivity, low-noise infrared (IR) detectors. The IR sensing mechanism is based on monitoring the change in the resonance frequency of the resonators upon near IR radiation. The resonators are characterized for their RF and thermal performance and exhibit a radiant responsivity of 1.68%/W, thermal time constant on the order of 556 μs, and an average IR responsivity of -1.5% when compared with a reference resonator, for a 100 mK radiation-induced temperature rise. An analysis of the design of the devices is presented as a path toward better design, specifically, for low thermal noise equivalent temperature difference in the long wavelength IR spectrum.

Gallium—nitride-on-handle substrate materials and devices and method of manufacture

Abstract: A gallium and nitrogen containing substrate structure includes a handle substrate member having a first surface and a second surface and a transferred thickness of gallium and nitrogen material. The structure has a gallium and nitrogen containing active region grown overlying the transferred thickness and a recessed region formed within a portion of the handle substrate member. The substrate structure has a conductive material formed within the recessed region configured to transfer thermal energy from at least the transferred thickness of gallium and nitrogen material.

Origin of Yellow-Band Emission in Epitaxially Grown GaN Nanowire Arrays

Abstract: Here, we report the origin of the yellow-band emission in epitaxial GaN nanowire arrays grown under carbon-free conditions. GaN nanowires directly grown on [0001]-oriented sapphire substrate exhibit an obvious and broad yellow-band in the visible range 400–800 nm, whereas the insertion of Al/Au layers in GaN–sapphire interface significantly depresses the visible emission, and only a sharp peak in the UV range (369 nm) can be observed. The persuasive differences in cathodoluminescence provide direct evidence for demonstrating that the origin of the yellow-band emission in GaN nanowire arrays arises from dislocation threading. The idea using buffering/barrier layers to isolate the dislocation threading in epitaxially grown GaN nanowires can be extended to the rational synthesis and structural defect controlling of a wide range of semiconductor films and nanostructures with superior crystal quality and excellent luminescence property.

β-Ga2O3 and single-crystal phosphors for high-brightness white LEDs and LDs, and β-Ga2O3 potential for next generation of power devices

Abstract: β-Ga2O3 is the most transparent conductive oxide, well known since several decades for its large bandgap of 4.8 eV. Its potential as semiconductor material, however, is just emerging in recent years. Present work shows the development of βGa2O3 for semiconductor applications and its current state-of-the-art. The discussion is focused on three different aspects: (1) Advantageous growth from melt of large-size β-Ga2O3single-crystals. High-crystalline quality and carrier control make possible the production of conductive and semi-insulating wafers. (2) β-Ga2O3as substrate for homoepitaxy as well as for heteroepitaxial deposition of GaN-based devices. High-brightness blue-LEDs with vertical current injection are demonstrated. (3) Potential of β-Ga2O3for high-power devices with higher breakdown voltage than GaN and SiC counterparts. The first Schottky barrier diode is shown, as well as first transistors (MESFET and MOSFET) are indicated. Single-crystal phosphors are introduced as novel alternative to currently used powder phosphors. In connection with high-brightness white light-sources, based on LEDs or LDs plus phosphor converters, single-crystal phosphors possess advantageous features. These avoid the use of resins and exhibit a very high internal quantum efficiency, which remains stable with the temperature increase.