32nm general purpose bulk CMOS technology for high performance applications at low voltage

TLDR: In this paper, a full 32 nm CMOS technology for high data rate and low operating power applications using a conventional high-k with single metal gate stack is presented for the first time, and a Hierarchical BEOL based on extreme low k (ELK) dielectric (k~2.4) is presented allowing high density wiring with low RC delay.

Abstract: This paper presents for the first time a full 32 nm CMOS technology for high data rate and low operating power applications using a conventional high-k with single metal gate stack. High speed digital transistors are demonstrated 22% delay reduction for ring oscillator (RO) at same power versus previous SiON technology. Significant matching factor (AVT) improvement (AVT~2.8 mV.um) and low 1/f noise aligned with poly SiON are reported. Excellent static noise margin (SNM) of 213 mV has been achieved at low voltage for a high density 0.157 um2 SRAM cell. Hierarchical BEOL based on extreme low k (ELK) dielectric (k~2.4) is presented allowing high density wiring with low RC delay. Reliability criteria have been met for hot carrier injection (HCI), gate dielectric break-down (TDDB) and bias temperature instability (BTI) extracted at 125degC.