Patent
System comprising a semiconductor device and structure
Zvi Or-Bach,Brian Cronquist,Israel Beinglass,Jan Lodewijk de Jong,Deepak C. Sekar,Zeev Wurman +5 more
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TLDR
In this article, a system includes a semiconductor device consisting of a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single-crystalline silicon layer.Abstract:
A system includes a semiconductor device. The semiconductor device includes a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layer. The second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands. Each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern.read more
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Patent
Methods of forming magnetic memory cells and semiconductor devices
Gurtej S. Sandhu,Witold Kula +1 more
TL;DR: In this paper, a getter material proximate to the secondary oxide region is formulated and configured to remove oxygen from the SOP, reducing an oxygen concentration and an electrical resistance of the secondary SOP.
Patent
Method of fabricating semiconductor component
TL;DR: In this paper, a method of fabricating the semiconductor component including following steps is provided, wherein an opening is already formed in the substrate and a material layer is formed on the substrate, wherein the material layer fills up the opening, and the material outer and above the opening has a recess therein.
Patent
Electronic devices with magnetic and attractor materials and methods of fabrication
TL;DR: In this paper, an attracter material is formulated to have a higher chemical affinity for a diffusible species of a magnetic material, from which the magnetic region is formed, compared to a chemical affinity between the diffusable species and at least another species of the magnetic material.
Patent
Method for flip chip packaging co-design
Jia-Wei Fang,Shen-Yu Huang +1 more
TL;DR: In this paper, a method for flip chip packaging co-design is presented, which comprises steps of: providing an I/O pad information of a chip and a connection information of the PCB, performing a first I/Os pad placement according to the I/OP pad information and the connection information, utilizing a RDL routing analysis device to perform a bump pad pitch analysis.
Patent
3D TSV assembly method for mass reflow
TL;DR: In this article, a plate and a die combination is used to attach a die to a device, substrate or another die by heating, while the plate remains on top of the die to permanently attach the die.
References
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Book
Digital Systems Testing and Testable Design
TL;DR: The new edition of Breuer-Friedman's Diagnosis and Reliable Design ofDigital Systems offers comprehensive and state-ofthe-art treatment of both testing and testable design.
Journal ArticleDOI
Nanowire transistors without junctions
Jean-Pierre Colinge,Chi-Woo Lee,Aryan Afzalian,Aryan Afzalian,Nima Dehdashti Akhavan,Ran Yan,Isabelle Ferain,Pedram Razavi,B. O'Neill,Alan Blake,Mary White,Anne-Marie Kelleher,Brendan McCarthy,Richard Murphy +13 more
TL;DR: A new type of transistor in which there are no junctions and no doping concentration gradients is proposed and demonstrated, which has near-ideal subthreshold slope, extremely low leakage currents, and less degradation of mobility with gate voltage and temperature than classical transistors.
Journal ArticleDOI
Designing reliable systems from unreliable components: the challenges of transistor variability and degradation
TL;DR: This article discusses effects of variability in transistor performance and proposes microarchitecture, circuit, and testing research that focuses on designing with many unreliable components (transistors) to yield reliable system designs.
Patent
Three dimensional structure memory
TL;DR: The 3Dimensional Structure (3DS) Memory (100) as mentioned in this paper is a three-dimensional structure (3D) memory that allows physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized.
Patent
Transparent contacts for organic devices
TL;DR: In this paper, a multicolor organic light emitting device employs vertically stacked layers of double heterostructure devices which are fabricated from organic compounds, and the devices are configured as stacked to provide a staircase profile whereby each device is separated from the other by a thin transparent conductive contact layer to enable light emanating from each of the devices to pass through the semitransparent contacts and through the lower device structures.