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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Dissertation

A novel “in-situ” processed gate region on GaN MOS capacitors

TL;DR: In this article, the authors reported a route to the realisation of GaN metal oxide semiconductor capacitors (MOSCAPs) where the GaN surface has not been exposed to atmosphere.
Journal ArticleDOI

A 400-V Half Bridge Gate Driver for Normally-Off GaN HEMTs With Effective <i>Dv/Dt</i> Control and High <i>Dv/Dt</i> Immunity

TL;DR: In this paper , the authors proposed two techniques to address the reliability issues caused by gallium nitride high electron mobility transistors, namely active overdrive voltage control and three-branch high-voltage level shifter.
Proceedings ArticleDOI

Switching Current Imbalance Mitigation for Paralleled SiC MOSFETs Using Common-mode Choke in Gate Loop

TL;DR: In this paper, a common-mode choke in the gate loop is proposed and analyzed to suppress the imbalanced switching current induced by asymmetric layout in a half-bridge configuration with a Kelvin-source connection.
Proceedings ArticleDOI

Analysis and Design of a High Power Density Full-Ceramic 900 V DC-Link Capacitor for a 550 kVA Electric Vehicle Drive Inverter

TL;DR: In this article , a full-ceramic 900 V DC-link capacitance for next-generation EV drive inverters is presented, including a comparative assessment with a state-of-the-art film-based solution.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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