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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Proceedings ArticleDOI

Parasitic Inductance Reduction Design Method of Vertical Lattice Loop Structure for Stable Driving of GaN HEMT

TL;DR: In this paper, a new method is used to reduce parasitic inductance, rather than reduce the influence of parasitic inductances through the circuit, which reduces ringing and overshoot in GaN HEMT.
Journal ArticleDOI

New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction

TL;DR: In this paper, a novel Ag foil bonding technique has been developed to bond Ag foils directly to Al substrates to produce Ag-cladded Al (Al2O3) substrates.
Proceedings ArticleDOI

A Comprehensive Analysis of Current Spikes in a Split-Phase Inverter

TL;DR: In this article , the authors presented a comprehensive analysis of current spikes in a split phase inverter with SPWM, characterized by the load power factor (PF), which can be used to optimize the size of split inductor.
Journal ArticleDOI

An Online Junction Temperature Monitoring Correction Method for SiC MOSFETs at Different Parasitic Parameters

TL;DR: In this article , a junction temperature correction method is proposed for silicon carbide (SiC) metaloxide-semiconductor field effect transistor (MOSFET) devices, which can largely eliminate the junction temperature monitoring error at different parasitic parameters.
Journal ArticleDOI

Time-Resolved Threshold Voltage Instability of 650-V Schottky Type p-GaN Gate HEMT Under Temperature-Dependent Forward and Reverse Gate Bias Conditions

TL;DR: In this article , a time-resolved threshold voltage instability of 650-V Schottky type p-GaN gate Al0.2Ga0.8N/GaN high electron mobility transistor (HEMT) under high-temperature gate bias (HTGB) conditions has been carried out.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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