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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Proceedings ArticleDOI

SIC power devices in power electronics: An overview

TL;DR: In this article, a general review on the properties of these materials comparing some performance between Si and SiC devices for typical power electronics applications is provided, based on studied information, line of progress and current state of developing, SiC seems to be the most viable substitute in high power and high temperature applications in the mid-term of Si, due to the fact that the GaN is still used in a reduced number of applications.
Journal ArticleDOI

A GaN-Based DC–DC Module for Railway Applications: Design Consideration and High-Frequency Digital Control

TL;DR: A 200 W two-stage rail grade dc–dc module based on gallium-nitride devices that converts a wide input voltage to a constant output voltage and can achieve 95.1% peak efficiency and 130 W/in$^3$ power density is developed.
Journal ArticleDOI

AC-DC Converters for Electrolyzer Applications: State of the Art and Future Challenges

TL;DR: It is shown that thyristors-based rectifiers are particularly fit for high-power applications but require the use of active and passive filters to enhance the power quality, and new emerging DC-DC converters must be employed to meet these important issues according to the availability of new power switching devices.
Journal ArticleDOI

A Non-Segmented PSpice Model of SiC mosfet With Temperature-Dependent Parameters

TL;DR: A non-segmented PSpice model of silicon carbide metal-oxide semiconductor field effect transistor (SiC mosfet ) with temperature-dependent parameters is proposed in this article, which can improve the model's convergence and temperature characteristics.
Proceedings ArticleDOI

Comparison between desaturation sensing and Rogowski coil current sensing for shortcircuit protection of 1.2 kV, 300 A SiC MOSFET module

TL;DR: In this article, the authors compared and evaluated the performance of two different protection methods on CREE 1.2 kV, 300 A SiC MOSFET module with different operating conditions.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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