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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Journal ArticleDOI

TCAD Based Investigation of Single Event Transient Effect in Double Channel AlGaN/GaN HEMT

TL;DR: In this paper, an investigation of double channel (DC) AlGaN/GaN HEMT has been presented using extensive TCAD simulation under the influence of Single Event Transient (SET) effect.
Proceedings ArticleDOI

Comparative evaluation of WBG and Si power devices for the flyback converter

TL;DR: It is shown that the WBG switch devices can reduce more power loss, improve efficiency, and enhance more power density instead of Si MOSFET.
Journal ArticleDOI

New Definition of Critical Energy for SiC MOSFET Robustness under Short- Circuit Operations: the Repetitive Critical Energy

TL;DR: In this article, a new parameter called the "repetitive critical energy" was introduced to ensure safe operation over a large number of short circuit (SC) events, which corresponds to a SC energy low enough to avoid excessive temperature increase so as to limit the transient gate leakage current during SC events.
Journal ArticleDOI

Cause and Effects of OFF-State Degradation in Hydrogen-Terminated Diamond MESFETs

TL;DR: In this paper, the reliability of hydrogen-terminated diamond metal semiconductor field effect transistors (MESFETs) submitted to off-state stress was investigated and it was shown that stress induces an increase in ON-resistance and a shift in the threshold voltage, along with a decrease in the transconductance peak value.
Proceedings ArticleDOI

Characterization and Detailed Analysis of The Crosstalk With SiC MOSFET

TL;DR: In this paper, the authors theoretically analyzes the process of establishing gate-source voltage of the synchronous MOSFET driver circuit, which considers the reverse recovery characteristic of the body diode of synchronous SiC MOS-FET.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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