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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Journal ArticleDOI

Temperature Dependence of Dynamic Performance Characterization of 1.2-kV SiC Power mosfets Compared With Si IGBTs for Wide Temperature Applications

TL;DR: In this paper, the temperature dependence of dynamic performance of 1.2-kV 4H-SiC power mosfet s is systematically characterized over such wide temperature range of 90 −493 K and compared with 1.1kV Si IGBT by a layout optimized double pulse tester (DPT).
Journal ArticleDOI

A comprehensive review on system architecture and international standards for electric vehicle charging stations

TL;DR: In this paper, the authors present an exposition of EV charging systems, including incentives for development, structures, power converters, standards, industrial applications, and emerging trends, and a quantitative assessment of the technologies has been provided in this paper.
Journal ArticleDOI

PowerSynth: A Power Module Layout Generation Tool

TL;DR: An overview of the tool, its modeling methods, model validation, and module layout optimization are presented, and excellent agreement between the FEA simulations, experimental measurements, and PowerSynth predictions are demonstrated.
Journal ArticleDOI

Thermal transport properties of GaN with biaxial strain and electron-phonon coupling

TL;DR: In this article, the thermal transport properties of GaN considering the effects from biaxial strain and electron-phonon coupling were investigated using the first principles calculation and phonon Boltzmann transport equation.
Journal ArticleDOI

Insulating materials for realising carbon neutrality: Opportunities, remaining issues and challenges

TL;DR: In this article , the authors discuss the challenges regarding design and reliability of insulations in electrical equipment and electric vehicles in the context of policies towards carbon neutrality rules, and also hope that this paper can be helpful in future development and research of novel insulating materials, which promote the realisation of the carbon-neutral vision.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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