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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Journal ArticleDOI

A Review of Switching Oscillations of Wide Bandgap Semiconductor Devices

TL;DR: This article reviews the types, the causes and negative effects, the effects of parasitic parameters and suppression methods of these switching oscillations of wide bandgap devices, and the advantages and disadvantages of these methods are presented.
Journal ArticleDOI

Accelerated insulation aging due to fast, repetitive voltages: A review identifying challenges and future research needs

TL;DR: The paper provides a framework for future research in dielectrics and electrical insulation design for systems under fast, repetitive voltage pluses originated by WBG-based conversion systems with dv/dt and switching frequency values.
Journal ArticleDOI

Power Electronic Converters in Electric Aircraft: Current Status, Challenges, and Emerging Technologies

TL;DR: In this paper, a comprehensive analysis of state-of-the-art power electronics in electric aircraft is provided, including wide bandgap devices, advanced topologies and control, thermal management, passive components, and system integration.
Journal ArticleDOI

A Short-Circuit Safe Operation Area Identification Criterion for SiC MOSFET Power Modules

TL;DR: This paper proposes a new method for the investigation of the short-circuit safe operation area (SCSOA) of state-of-the-art SiC MOSFET power modules rated at 1.2 kV based on the variations inSiC M OSFET electrical parameters (e.g., short- Circuit current and gate–source voltage).
Journal ArticleDOI

Experimental Demonstration of a 98.8% Efficient Isolated DC–DC GaN Converter

TL;DR: The design and implementation of high-efficiency magnetics necessary to realize an isolated full bridge dc–dc converter are presented and the experimental demonstration of ultrahigh efficiency in a 2-kW isolated GaN converter is presented.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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