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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Journal ArticleDOI

Analysis and Comparison of the Radiated Electromagnetic Interference Generated by Power Converters With Si MOSFET s and GaN HEMTs

TL;DR: In this paper, the effects of the parameters of GaN HEMTs and Si mosfet s and the load conditions on the radiated electromagnetic interference (EMI) are analyzed based on the compositions of the equivalent noise voltage sources.
Journal ArticleDOI

Improved Operation of SiC–BJT-Based Series Resonant Inverter With Optimized Base Drive

TL;DR: In this paper, an optimized base drive circuit for a zero-voltage switching series resonant inverter was proposed to maximize the driver efficiency and minimise the driver current requirements.
Journal ArticleDOI

Impact of Repetitive Short-Circuit Tests on the Normal Operation of SiC MOSFETs Considering Case Temperature Influence

TL;DR: In this paper, the impact of repetitive short-circuit (SC) tests on the normal operation of a commercial silicon carbide (SiC) MOSFET and the influence of different case temperatures on the SC degradation process were investigated.
Proceedings ArticleDOI

Comparative performance evaluation of temperature dependent characteristics and power converter using GaN, SiC and Si power devices

TL;DR: In this paper, a comparative analysis of gallium nitride (GaN) and silicon carbide (SiC) power electronics switching devices is presented, and the results show that GaN based converter has better switching performance and overall efficiency, but have strong dependency of temperature.
Proceedings ArticleDOI

Bidirectional, SiC module-based solid-state circuit breakers for 270 V dc MEA/AEA systems

TL;DR: In this paper, a SiC-based solid-state circuit breaker (SSCB) was developed for applications within MEA/AEA power systems, and the design and development of a SSCB technology demonstrator based on an all-SiC power module was presented.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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