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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Proceedings ArticleDOI

Multi-objective optimization of gate driver circuit for GaN HEMT in electric vehicles

TL;DR: Simulation results highlight the effectiveness of the proposed design approach of GaN High Electron Mobility Transistor gate driver circuit for electric vehicles, as both higher efficiency and lower EMI level have been successfully achieved.
Proceedings ArticleDOI

Switching Characterization of SiC MOSFETs in Three-Level Active Neutral-Point-Clamped Inverter Application

TL;DR: In this article, the switching characteristics of SiC MOSFETs in a three-level active neutral-point-clamped (3L-ANPC) inverter are investigated.
Journal ArticleDOI

Common-Mode Voltage Elimination in Multilevel Power Inverter-Based Motor Drive Applications

TL;DR: This work is to determine how multilevel power converters provide additional degrees of freedom to make the reduction of the CMV possible by using specific modulation techniques, making it easier for engineers and scientists in this field to find solutions to this problem.
Journal ArticleDOI

Gate-Driver Integrated Junction Temperature Estimation of SiC MOSFET Modules

TL;DR: In this paper , the authors focus on improving the reliability of the SiC MOSFET, accomplished by generating intelligence on the gate driver (GD) with providing insight on real-time behavior of relevant switch information.
Proceedings ArticleDOI

Capacitor-Based Three-Level Gate Driver for GaN HEMT Only with a Single Voltage Supply

TL;DR: In this paper, the authors proposed a three-level gate driver for Gallium Nitride High Electron Mobility Transistor (GaN HEMT) using only a single voltage supply.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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