scispace - formally typeset
Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

read more

Citations
More filters
Journal ArticleDOI

Planar edge terminations for high voltage 4H-SiC power MOSFETs

TL;DR: In this paper, several edge termination structures for high voltage 4H-SiC devices compatible with a planar power MOSFET fabrication process are analyzed, and the edge terminations' efficiency has been experimentally demonstrated on PiN diodes with breakdown voltage capabilities ranging from 2 to 5 kV.
Journal ArticleDOI

A SiC and Si Hybrid Five-Level Unidirectional Rectifier for Medium Voltage Applications

TL;DR: In this article , the authors proposed a silicon carbide (SiC) and silicon (Si) hybrid five-level unidirectional rectifier, which requires only four SiC and four Si diodes.
Journal ArticleDOI

Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg

TL;DR: In this article, the authors present a power module that integrates two silicon-carbide (SiC) JFETs to form an inverter leg, where the power devices are placed between two ceramic substrates, allowing for heat extraction from both sides of the dies.
Proceedings ArticleDOI

Evaluation of power loss and mass gains of SiC versus Si-based switch-mode power supplies using a multiobjective optimization CAD tool

Abstract: In this paper, the power losses and mass of multiobjective optimal designed isolated dc-dc converters are compared, based on Si and SiC technologies. To that end, a computer-aided design (CAD) tool, previously published by the authors, is used. The database of the existing tool is enriched with wide band gap semiconductor devices currently available from manufacturers. The results are presented for two switchmode power supplies operating at very different power levels. The gains in terms of power losses and mass from one technology to the other are quantified thanks to the CAD tool, which is an asset.
Journal ArticleDOI

Matrix Inductor With DC-Bias Effect Reduction Capability for GaN-Based DC-DC Boost Converter

TL;DR: Since the four phases are operated in parallel, the phase error, which is a critical problem in the interleaved structure, may not affect the proposed converter, removing the current balance issue.
References
More filters
Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
Related Papers (5)