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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Journal ArticleDOI

Negative Conductance Modeling and Stability Analysis of High-Frequency Oscillation Based on Cascode GaN Circuits

TL;DR: Oscillation problems will be explained by oscillator theory and an oscillation suppression method will be introduced based on the established model based on negative conductance models of the GaN devices in the switching-on and switching-off process.
Journal ArticleDOI

A Quasi-Two-Level Medium-Voltage SiC MOSFET Power Module With Low Loss and Voltage Self-Balance

TL;DR: In this article , an indirect series-connected SiC MOSFET power module using quasi-two-level hybrid-clamp topology is proposed, where the voltages across the devices are automatically balanced with an open-loop modulation strategy to avoid sensors and control algorithm.
Dissertation

Contribution to the study of the SiC MOSFETs gate oxide

TL;DR: In this article, the I-V curve (of the intrinsic diode) remains stable after the application of a current stress in static mode, but also with the DUT placed in a converter with inductive switchings.

Characterization Methodology, Modeling, and Converter Design for 600 V Enhancement-Mode GaN FETs

TL;DR: In this article, the authors review the unique characteristics, commercial status, and design challenges that surround GaN FETs, in order to provide sufficient background to potential GaN-based converter designers.
Journal ArticleDOI

The Role of Defects on Forward Current in 4H-SiC p-i-n Diodes

TL;DR: In this article, the authors investigated the impact of defect states on the measured forward current-voltage (I$ -V$ ) curves of planar 4H-SiC p-i-n diodes of a different anode dimension by means of a fine-tuned numerical model.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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