scispace - formally typeset
Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

read more

Citations
More filters
Journal ArticleDOI

Defect evolution of oxygen induced Vth-shift for ON-state biased AlGaN/GaN HEMTs

TL;DR: In this paper, the defect evolution of O from negatively charged VGa-ON to neutral ON-H gives rise to the decrease in acceptors in the GaN channel and thus the negative shift of Vth.
Proceedings ArticleDOI

An Intelligent Three-level Active Gate Driver for Crosstalk Suppression of SiC MOSFET

TL;DR: In this article, an intelligent three-level active gate driver is proposed by improving the conventional drive circuit, which can regulate the gate voltage from 0V to -5V when a positive spike occurs.
Journal ArticleDOI

Insights into radiation displacement defect in an insulated-gate bipolar transistor

TL;DR: In this article, the effects of the radiation displacement defect on an insulated-gate bipolar transistor are investigated using the computer-aided design simulation technology, and DC characteristics, breakdown voltage, and power dissipation are analyzed according to the position, energy, and types of trap caused by the radiation effect.
Journal ArticleDOI

Electromagnetic Compatibility Analysis of an Induction Motor Drive With Integrated Power Converter

TL;DR: The electromagnetic compatibility of the power converter integrated in an induction motor is investigated and it is shown that the leakage magnetic flux of the end-winding will penetrate into the nearby area, and it will cause interference with the Hall-effect current sensors if the power converter is mounted in the space between the motor end cap and the end ofwinding.
References
More filters
Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
Related Papers (5)