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Journal ArticleDOI

A Survey of Wide Bandgap Power Semiconductor Devices

TLDR
In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract
Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.

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Citations
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Proceedings ArticleDOI

An improved analytical model of GaN HEMT in cascode configuration during turn-on transition

TL;DR: An improved analytical model suitable for a high voltage Gallium Nitride high electron mobility transistor (GaN HEMT) in cascode configuration is presented to analyze operating condition and calculate the energy losses during turn-on transition.

Comparison of Commercial Planar and Trench SiC MOSFETs by Electrical Characterization of Performance-Degrading Near-Interface Traps

TL;DR: In this paper , a commercial 1200-V SiC trench MOSFET has been compared with a planar MOS-FET obtained from the same manufacturer, and the authors employed a newly developed integrated charge method to quantify the near interface traps (NITs).
Journal ArticleDOI

Highly reliable joining for high-temperature power modules: Ni–Sn DSLID with an Al sheet

TL;DR: In this paper, a joining concept involving nickel-tin (Ni-Sn) double solid liquid interdiffusion with an aluminium (Al) sheet (Ni−Sn DSLID/Al), which enables the production of modules with high thermal reliability was proposed.
Book ChapterDOI

Reliability and Failure Mechanisms of Sintered Silver as Die Attach Joint

TL;DR: In this article, the reliability of sintered Ag joint in terms of elastic modulus, shear strength, tensile strength, creep strength, fatigue strength, and related failure mechanisms under normal and accelerated conditions, as well as failure mechanism like electrochemical migration.
Journal ArticleDOI

New Modulation Strategy for Five-Phase High-Frequency VSI Based on Sigma–Delta Modulators

TL;DR: In this paper , the authors proposed a modulation strategy for a five-phase high-frequency voltage source inverter based on sigma-delta (SDS) modulators, which is an improvement over 2L+2M SVM.
References
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Journal ArticleDOI

Recessed-gate structure approach toward normally off high-Voltage AlGaN/GaN HEMT for power electronics applications

TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Journal ArticleDOI

Control of Threshold Voltage of AlGaN/GaN HEMTs by Fluoride-Based Plasma Treatment: From Depletion Mode to Enhancement Mode

TL;DR: In this paper, a method with an accurate control of threshold voltages of AlGaN/GaN high-electron mobility transistors (HEMTs) using a fluoride-based plasma treatment was presented.
Journal ArticleDOI

AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications

TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Journal ArticleDOI

Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistor

TL;DR: In this paper, a 0.25 μm gate length AlGaN/GaN heterostructure field effect transistor (HFET) with a maximum extrinsic transconductance of 27 mS/mm (at room temperature) limited by the source series resistance was fabricated.
Proceedings ArticleDOI

40-W/mm Double Field-plated GaN HEMTs

TL;DR: In this paper, a double field-plated GaN HEMT with increased power density and robustness was presented, where a first field plate (FP1) was integrated with the gate for both reduced gate resistance and elimination of electron trapping.
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