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Fundamentals of Power Semiconductor Devices

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TLDR
In this article, the fundamental physics of power semiconductor devices are discussed and an analytical model for explaining the operation of all power Semiconductor devices is presented, focusing on silicon devices.
Abstract
Fundamentals of Power Semiconductor Devices provides an in-depth treatment of the physics of operation of power semiconductor devices that are commonly used by the power electronics industry. Analytical models for explaining the operation of all power semiconductor devices are shown. The treatment focuses on silicon devicesandincludes the unique attributes and design requirements for emerging silicon carbide devices.

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Journal ArticleDOI

Special features of Fowler-Nordheim stress degradation of SiC-MOSFETs

TL;DR: In this paper, the authors report special features of I ds-V gs and I g-Vgs characteristics of commercially available SiC-MOSFETs during high-gate-voltage and high-temperature stress.
Proceedings ArticleDOI

Solid-state Marx generator with 24 KV 4H-SIC IGBTs

TL;DR: In this article, the state-of-the-art 24-kV n-channel silicon carbide insulated-gate bipolar transistors (IGBTs) for Marx generator circuits were evaluated in a small-scale, four-stage voltage multiplication circuit.
Proceedings ArticleDOI

Characterization of 1.2 kV 4H-SiC power MOSFETs and Si IGBTs at cryogenic and high temperatures

TL;DR: In this paper, the static and switching performance of 1.2kV 4H-SiC planar MOSFETs, Si IGBT and Si trench IGBT over a wide temperature range of 90k to 493k was analyzed.
Proceedings ArticleDOI

A comparative efficiency study on bidirectional grid interface converters applied to low power DC nanogrids

TL;DR: A comparative efficiency study of different topologies for the bidirectional grid interface converter (BGIC) for applications in DC microgrids, which manage the power flow between the utility grid and the DC microgrid with the intent to regulate the main DC bus voltage and simultaneously ensure grid code compliance at the point of common coupling.
Journal ArticleDOI

Electric Field and Interface Charge Extraction in Field-Plate Assisted RESURF Devices

TL;DR: In this article, a methodology for extracting the lateral electric field in the drain extension of thin silicon-on-insulator highvoltage field-plate assisted reduced surface field (RESURF) devices is detailed including its limits and its accuracy.
References
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Book

Modern power devices

TL;DR: In this article, the authors introduce the concept of field effect transistors in the context of rectifier concepts and introduce a new Rectifier concept called Field Effect Transistor (FET) this article.
Journal ArticleDOI

Silicon-carbide high-voltage (400 V) Schottky barrier diodes

TL;DR: In this paper, the fabrication and characteristics of the first high-voltage (400-V) silicon-carbide (6H-SiC) Schottky barrier diodes are described.
Journal ArticleDOI

Temperature dependence of hole impact ionization coefficients in 4H and 6H-SiC

TL;DR: In this paper, hole impact ionization coefficients have been accurately measured as a function of temperature in both 4H and 6H-SiC using the pulsed electron beam induced current (P-EBIC) technique.
Journal ArticleDOI

Evolution of MOS-bipolar power semiconductor technology

TL;DR: A review of the evolution of a power transistor technology based on MOS gate control is provided in this article, which offers the advantage of very high input impedance, which allows the control of the devices using low-cost integrated circuits.