Institution
Varian Associates
About: Varian Associates is a based out in . It is known for research contribution in the topics: Beam (structure) & Wafer. The organization has 2160 authors who have published 2591 publications receiving 46002 citations.
Topics: Beam (structure), Wafer, Amplifier, Cathode, Resonance
Papers published on a yearly basis
Papers
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Patent•
03 Jan 195223 citations
TL;DR: In this article, a radial thermal gradient at the column inlet generated by an imbalance between the inlet fluid and column temperature is investigated. And the significance of this effect and a means to reduce it in elevated temperature HPLC is demonstrated.
23 citations
TL;DR: The absolute configuration of cularine has been shown to be d (= R) from the ORD of its hydrogenolysis product (VIII) as mentioned in this paper, which is attributed to steric hindrance to rotation of the 2′-substituted benzyl moiety.
23 citations
TL;DR: Die Strukturaufklärung von Cylindrocarpin (II) and CylINDrocarpidin (IV) zeigt, dass diese zwei Alkaloide die ersten Mitglieder der Aspidosperminfamilie (I) sind, in denen eine sauerstoffhaltige Seitenkette anstatt der gewöhnlichen C-5-�
Abstract: Die Strukturaufklarung von Cylindrocarpin (II) und Cylindrocarpidin (IV) zeigt, dass diese zwei Alkaloide die ersten Mitglieder der Aspidosperminfamilie (I) sind, in denen eine sauerstoffhaltige Seitenkette anstatt der gewohnlichen C-5-Athylgruppe vorliegt.
23 citations
Patent•
30 Apr 1996TL;DR: A clampless heat exchange station for a semiconductor wafer for use in a vacuum chamber, at pressures from 2 Torr to 30 Torr using commercial grade inert gas is described in this paper.
Abstract: A clampless heat exchange station for a semiconductor wafer for use in a vacuum chamber, at pressures from 2 Torr to 30 Torr using commercial grade inert gas. The heat exchange chuck has apertures therethrough in the region where the wafer is to be mounted to serve as a miniature plenum gas to provide equal pressure along the bottom and top sides of the wafer. This configuration avoids chipping and particle deposition and provides improved heat transfer rate and wafer temperature uniformity.
23 citations
Authors
Showing all 2160 results
| Name | H-index | Papers | Citations |
|---|---|---|---|
| Richard R. Ernst | 96 | 352 | 53100 |
| Fred E. Regnier | 88 | 412 | 25169 |
| Norbert Schuff | 88 | 280 | 25442 |
| James S. Hyde | 79 | 412 | 35755 |
| Carl Djerassi | 77 | 1523 | 37630 |
| Ray Freeman | 73 | 269 | 22872 |
| Robert Kaptein | 72 | 436 | 24275 |
| Minghwei Hong | 58 | 515 | 14309 |
| Jesse L. Beauchamp | 55 | 275 | 10971 |
| Herbert Kroemer | 52 | 237 | 9936 |
| Hans J. Jakobsen | 49 | 274 | 8401 |
| James N. Eckstein | 42 | 168 | 6634 |
| Ivan Bozovic | 31 | 128 | 5060 |
| John Glushka | 31 | 76 | 3004 |
| Gary Virshup | 24 | 113 | 2374 |