Journal ArticleDOI
High-performance fully depleted silicon nanowire (diameter /spl les/ 5 nm) gate-all-around CMOS devices
Navab Singh,Ajay Agarwal,Lakshmi Kanta Bera,Tsung-Yang Liow,R. Yang,S.C. Rustagi,C.H. Tung,Rakesh Kumar,G. Q. Lo,N. Balasubramanian,Dim-Lee Kwong +10 more
TLDR
In this article, gate-all-around (GAA) n-and p-FETs on a silicon-on-insulator with 5-nm-diameter laterally formed Si nanowire channel were demonstrated.Abstract:
This paper demonstrates gate-all-around (GAA) n- and p-FETs on a silicon-on-insulator with /spl les/ 5-nm-diameter laterally formed Si nanowire channel. Alternating phase shift mask lithography and self-limiting oxidation techniques were utilized to form 140- to 1000-nm-long nanowires, followed by FET fabrication. The devices exhibit excellent electrostatic control, e.g., near ideal subthreshold slope (/spl sim/ 63 mV/dec), low drain-induced barrier lowering (/spl sim/ 10 mV/V), and with I/sub ON//I/sub OFF/ ratio of /spl sim/10/sup 6/. High drive currents of /spl sim/ 1.5 and /spl sim/1.0 mA//spl mu/m were achieved for 180-nm-long nand p-FETs, respectively. It is verified that the threshold voltage of GAA FETs is independent of substrate bias due to the complete electrostatic shielding of the channel body.read more
Citations
More filters
Journal ArticleDOI
Power and delay analysis of different SRAM cell structures with different technology node
TL;DR: Comparing leakage power, dynamic power and static power at 90 nm technology and write delay, read delay at both 90-nm and 45-nm technology in nine transistors (9 t), eight transistor (8 t) and six transistor (6 T) sram cell.
Proceedings ArticleDOI
A In-depth Simulation Study of CMOS Inverters Based on the Novel Surrounding Gate Transistors
TL;DR: In this paper, the main features of CMOS inverters based on the novel surrounding gate transistors (SGT) have been analyzed and the transient response of a ring oscillator is investigated to explore the scaling possibilities of these devices.
Stochastic models of surface limited electronic and heat transport in metal and semiconductor contacts, wires, and sheets---micro to nano
TL;DR: In this paper, the effect of surface roughness in coupled mechanical, electronic and thermal processes in N/MEMS and semiconductor devices in the 10 nm 1 μm range is investigated.
Chapter 3 Design Technologies for Nanoelectronic Systems Beyond Ultimately Scaled CMOS
Haykel Ben Jamaa,Bahman Kheradmand Boroujeni,Giovanni De Micheli,Yusuf Leblebici,Christian Piguet,Alexandre Schmid,Milos Stanisavljevic +6 more
Proceedings ArticleDOI
Interactions between precisely placed dopants and interface roughness in silicon nanowire transistors: Full 3-D NEGF simulation study
TL;DR: In this article, the impact of surface roughness on the performance of ultimately scaled gate-all-around silicon nanowire transistors with precisely positioned dopants designed for digital circuit applications is analyzed.
References
More filters
Journal ArticleDOI
High Performance Silicon Nanowire Field Effect Transistors
TL;DR: In this article, the influence of source-drain contact thermal annealing and surface passivation on key transistor properties was examined, and it was shown that thermal annaling and passivation of oxide defects using chemical modification can increase the average transconductance from 45 to 800 nS and average mobility from 30 to 560 cm 2 /V
Journal ArticleDOI
FinFET-a self-aligned double-gate MOSFET scalable to 20 nm
Digh Hisamoto,Wen-Chin Lee,J. Kedzierski,Hideki Takeuchi,K. Asano,C. Kuo,Erik H. Anderson,Tsu-Jae King,Jeffrey Bokor,Chenming Hu +9 more
TL;DR: In this paper, a self-aligned double-gate MOSFET, FinFET was proposed by using boron-doped Si/sub 04/Ge/sub 06/ as a gate material.
Journal ArticleDOI
High-performance thin-film transistors using semiconductor nanowires and nanoribbons
Xiangfeng Duan,Chunming Niu,Vijendra Sahi,Jian Chen,J. Wallace Parce,Stephen Empedocles,Jay L. Goldman +6 more
TL;DR: It is shown that high-performance TFTs can be produced on various substrates, including plastics, using a low-temperature assembly process and the approach is general to a broad range of materials including high-mobility materials (such as InAs or InP).
Journal ArticleDOI
Double-gate silicon-on-insulator transistor with volume inversion: A new device with greatly enhanced performance
TL;DR: The double-gate control of silicon-on-insulator (SOI) transistors is used to force the whole silicon film (interface layers and volume) in strong inversion as discussed by the authors.
Journal ArticleDOI
Benchmarking nanotechnology for high-performance and low-power logic transistor applications
R. Chau,Suman Datta,Mark Beaverton Doczy,B. Doyle,B. Jin,Jack Portland Kavalieros,Amlan Majumdar,Matthew V. Metz,Marko Radosavljevic +8 more
TL;DR: The results of this benchmarking exercise indicate that while these novel nanoelectronic devices show promise and opportunities for future logic applications, there still remain shortcomings in the device characteristics and electrostatics that need to be overcome.