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Journal ArticleDOI

High-performance fully depleted silicon nanowire (diameter /spl les/ 5 nm) gate-all-around CMOS devices

TLDR
In this article, gate-all-around (GAA) n-and p-FETs on a silicon-on-insulator with 5-nm-diameter laterally formed Si nanowire channel were demonstrated.
Abstract
This paper demonstrates gate-all-around (GAA) n- and p-FETs on a silicon-on-insulator with /spl les/ 5-nm-diameter laterally formed Si nanowire channel. Alternating phase shift mask lithography and self-limiting oxidation techniques were utilized to form 140- to 1000-nm-long nanowires, followed by FET fabrication. The devices exhibit excellent electrostatic control, e.g., near ideal subthreshold slope (/spl sim/ 63 mV/dec), low drain-induced barrier lowering (/spl sim/ 10 mV/V), and with I/sub ON//I/sub OFF/ ratio of /spl sim/10/sup 6/. High drive currents of /spl sim/ 1.5 and /spl sim/1.0 mA//spl mu/m were achieved for 180-nm-long nand p-FETs, respectively. It is verified that the threshold voltage of GAA FETs is independent of substrate bias due to the complete electrostatic shielding of the channel body.

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Citations
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Journal ArticleDOI

Analysis of Low Frequency Drain Current Model for Silicon Nanowire Gate-All-Around Field Effect Transistor

TL;DR: In this paper, the low frequency noise behavior in subthreshold regime of gate-all-around silicon nanowire field effect transistors was investigated and it was shown that noise is decreasing with frequency.
Journal ArticleDOI

Performance of Vertical Gate-All-Around Nanowire p–MOS Transistors Determined by Boron Depletion during Oxidation

TL;DR: In this article , 3D TCAD process and device simulations were performed using Synopsys Sentaurus and the results are compared with experimental data of devices fabricated at CNRS-LAAS.
Proceedings ArticleDOI

Transport properties of strained silicon nanowires

TL;DR: It is shown that silicon nanowires are very sensitive to strains, so that strain engineering shall be a highly efficient booster for nanowire technologies.
Proceedings ArticleDOI

Study of gate all around InAs/Si based nanowire FETs using simulation approach

TL;DR: In this paper, a gate-all-around Si Nanowire FET (NWFET) and InAs NWFET have been compared with respect to various performance parameters, including transfer characteristics, transconductance, output characteristics, drive and leakage current, switching speed (Ion/Ioff), conduction-band profile, subthreshold swing (SS) and drain induced barrier lowering (DIBL).
Proceedings ArticleDOI

Influence of boundary force on the performance of gate-all-around Ge (110) NW FETs with HfO 2 gate insulator

TL;DR: In this paper, the authors calculate valence band structures and transport property of HfO 2 gate dielectric surrounded Ge (110) nanowire with a radial force at the boundary of the insulator.
References
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Journal ArticleDOI

High Performance Silicon Nanowire Field Effect Transistors

TL;DR: In this article, the influence of source-drain contact thermal annealing and surface passivation on key transistor properties was examined, and it was shown that thermal annaling and passivation of oxide defects using chemical modification can increase the average transconductance from 45 to 800 nS and average mobility from 30 to 560 cm 2 /V
Journal ArticleDOI

FinFET-a self-aligned double-gate MOSFET scalable to 20 nm

TL;DR: In this paper, a self-aligned double-gate MOSFET, FinFET was proposed by using boron-doped Si/sub 04/Ge/sub 06/ as a gate material.
Journal ArticleDOI

High-performance thin-film transistors using semiconductor nanowires and nanoribbons

TL;DR: It is shown that high-performance TFTs can be produced on various substrates, including plastics, using a low-temperature assembly process and the approach is general to a broad range of materials including high-mobility materials (such as InAs or InP).
Journal ArticleDOI

Double-gate silicon-on-insulator transistor with volume inversion: A new device with greatly enhanced performance

TL;DR: The double-gate control of silicon-on-insulator (SOI) transistors is used to force the whole silicon film (interface layers and volume) in strong inversion as discussed by the authors.
Journal ArticleDOI

Benchmarking nanotechnology for high-performance and low-power logic transistor applications

TL;DR: The results of this benchmarking exercise indicate that while these novel nanoelectronic devices show promise and opportunities for future logic applications, there still remain shortcomings in the device characteristics and electrostatics that need to be overcome.
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