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Journal ArticleDOI

High-performance fully depleted silicon nanowire (diameter /spl les/ 5 nm) gate-all-around CMOS devices

TLDR
In this article, gate-all-around (GAA) n-and p-FETs on a silicon-on-insulator with 5-nm-diameter laterally formed Si nanowire channel were demonstrated.
Abstract
This paper demonstrates gate-all-around (GAA) n- and p-FETs on a silicon-on-insulator with /spl les/ 5-nm-diameter laterally formed Si nanowire channel. Alternating phase shift mask lithography and self-limiting oxidation techniques were utilized to form 140- to 1000-nm-long nanowires, followed by FET fabrication. The devices exhibit excellent electrostatic control, e.g., near ideal subthreshold slope (/spl sim/ 63 mV/dec), low drain-induced barrier lowering (/spl sim/ 10 mV/V), and with I/sub ON//I/sub OFF/ ratio of /spl sim/10/sup 6/. High drive currents of /spl sim/ 1.5 and /spl sim/1.0 mA//spl mu/m were achieved for 180-nm-long nand p-FETs, respectively. It is verified that the threshold voltage of GAA FETs is independent of substrate bias due to the complete electrostatic shielding of the channel body.

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Citations
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Analysis of GAA Tunnel FET using MATLAB

TL;DR: In this article, a gate all around (GAA) structure is proposed to obtain high ION and low IOFF in a GAA TFET with a virtue of meeting the low power and high performance specifications of International Technology Roadmap of Semiconductors (ITRS) projected to year 2020, at a reduced drain voltage (VDD) = 0.5 V.

Electronic Structures and Band Gap of Doped Silicon Nanowires (SiNWs)

TL;DR: In this paper, the authors used the nearest neighbor sp 3 d 5 s* atomic orbital basis to find out the electronic properties of silicon nanowires (SiNWs) for different crystal orientation, cross-sectional size and shape.
Journal ArticleDOI

Hole Transconductance of [100] Long-Channel Si Nanowire Transistor

TL;DR: In this article, hole transport characteristics of Si nanowire (NW) p-channel metal-oxide semiconductor with different lengths (2 μm, 5μm, 10 μm and 20 μm) were examined.
Proceedings Article

3D transistors

TL;DR: In this paper, the authors proposed a multigate 3D transistor architecture, which allows one to reduce short-channel effects well below the 20nm node and have the potential to extend Moore's law down to a gate length of 3nm.
References
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Journal ArticleDOI

High Performance Silicon Nanowire Field Effect Transistors

TL;DR: In this article, the influence of source-drain contact thermal annealing and surface passivation on key transistor properties was examined, and it was shown that thermal annaling and passivation of oxide defects using chemical modification can increase the average transconductance from 45 to 800 nS and average mobility from 30 to 560 cm 2 /V
Journal ArticleDOI

FinFET-a self-aligned double-gate MOSFET scalable to 20 nm

TL;DR: In this paper, a self-aligned double-gate MOSFET, FinFET was proposed by using boron-doped Si/sub 04/Ge/sub 06/ as a gate material.
Journal ArticleDOI

High-performance thin-film transistors using semiconductor nanowires and nanoribbons

TL;DR: It is shown that high-performance TFTs can be produced on various substrates, including plastics, using a low-temperature assembly process and the approach is general to a broad range of materials including high-mobility materials (such as InAs or InP).
Journal ArticleDOI

Double-gate silicon-on-insulator transistor with volume inversion: A new device with greatly enhanced performance

TL;DR: The double-gate control of silicon-on-insulator (SOI) transistors is used to force the whole silicon film (interface layers and volume) in strong inversion as discussed by the authors.
Journal ArticleDOI

Benchmarking nanotechnology for high-performance and low-power logic transistor applications

TL;DR: The results of this benchmarking exercise indicate that while these novel nanoelectronic devices show promise and opportunities for future logic applications, there still remain shortcomings in the device characteristics and electrostatics that need to be overcome.
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