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Journal ArticleDOI

High-performance fully depleted silicon nanowire (diameter /spl les/ 5 nm) gate-all-around CMOS devices

TLDR
In this article, gate-all-around (GAA) n-and p-FETs on a silicon-on-insulator with 5-nm-diameter laterally formed Si nanowire channel were demonstrated.
Abstract
This paper demonstrates gate-all-around (GAA) n- and p-FETs on a silicon-on-insulator with /spl les/ 5-nm-diameter laterally formed Si nanowire channel. Alternating phase shift mask lithography and self-limiting oxidation techniques were utilized to form 140- to 1000-nm-long nanowires, followed by FET fabrication. The devices exhibit excellent electrostatic control, e.g., near ideal subthreshold slope (/spl sim/ 63 mV/dec), low drain-induced barrier lowering (/spl sim/ 10 mV/V), and with I/sub ON//I/sub OFF/ ratio of /spl sim/10/sup 6/. High drive currents of /spl sim/ 1.5 and /spl sim/1.0 mA//spl mu/m were achieved for 180-nm-long nand p-FETs, respectively. It is verified that the threshold voltage of GAA FETs is independent of substrate bias due to the complete electrostatic shielding of the channel body.

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Citations
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Journal ArticleDOI

High-field hole transport in silicon nanowires

TL;DR: In this article, ensemble Monte Carlo hole transport simulations for small diameter silicon nanowires are provided by band structure calculations using sp3d5s∗ tight-binding scheme and principal scattering mechanisms considered are hole-bulk acoustic and optical phonon interactions.
Journal ArticleDOI

The size dependence of tin oxide atomic cluster nanowire field effect transistors

TL;DR: The cluster nanowires used to fabricate field effect transistors demonstrated a clear size-dependent behaviour and with zero gate bias the narrowest wires were depleted, both the carrier concentration and the conduction quickly increasing with wire width.
Patent

Hybrid cmos nanowire mesh device and pdsoi device

TL;DR: In this paper, a method of forming a hybrid semiconductor structure on an SOI substrate is presented, which includes an integrated process flow to form a nanowire mesh device and a PDSOI device on the same SOI-based substrate.
Journal ArticleDOI

Vertically Integrated Nanowire-Based Unified Memory

TL;DR: A novel memory hierarchy design with high functionality for system-on-chip (SoC) architectures is described, demonstrating the practicality and versatility of the vertically integrated nanowire configuration for use in various applications.
Journal ArticleDOI

Fabrication of locally thinned down silicon nanowires

TL;DR: In this article, a top-down fabrication process was proposed to prepare locally thinned down silicon nanowire field effect devices at wafer-scale using tetramethylammonium hydroxide wet-etching.
References
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Journal ArticleDOI

High Performance Silicon Nanowire Field Effect Transistors

TL;DR: In this article, the influence of source-drain contact thermal annealing and surface passivation on key transistor properties was examined, and it was shown that thermal annaling and passivation of oxide defects using chemical modification can increase the average transconductance from 45 to 800 nS and average mobility from 30 to 560 cm 2 /V
Journal ArticleDOI

FinFET-a self-aligned double-gate MOSFET scalable to 20 nm

TL;DR: In this paper, a self-aligned double-gate MOSFET, FinFET was proposed by using boron-doped Si/sub 04/Ge/sub 06/ as a gate material.
Journal ArticleDOI

High-performance thin-film transistors using semiconductor nanowires and nanoribbons

TL;DR: It is shown that high-performance TFTs can be produced on various substrates, including plastics, using a low-temperature assembly process and the approach is general to a broad range of materials including high-mobility materials (such as InAs or InP).
Journal ArticleDOI

Double-gate silicon-on-insulator transistor with volume inversion: A new device with greatly enhanced performance

TL;DR: The double-gate control of silicon-on-insulator (SOI) transistors is used to force the whole silicon film (interface layers and volume) in strong inversion as discussed by the authors.
Journal ArticleDOI

Benchmarking nanotechnology for high-performance and low-power logic transistor applications

TL;DR: The results of this benchmarking exercise indicate that while these novel nanoelectronic devices show promise and opportunities for future logic applications, there still remain shortcomings in the device characteristics and electrostatics that need to be overcome.
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