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Journal ArticleDOI

High-performance fully depleted silicon nanowire (diameter /spl les/ 5 nm) gate-all-around CMOS devices

TLDR
In this article, gate-all-around (GAA) n-and p-FETs on a silicon-on-insulator with 5-nm-diameter laterally formed Si nanowire channel were demonstrated.
Abstract
This paper demonstrates gate-all-around (GAA) n- and p-FETs on a silicon-on-insulator with /spl les/ 5-nm-diameter laterally formed Si nanowire channel. Alternating phase shift mask lithography and self-limiting oxidation techniques were utilized to form 140- to 1000-nm-long nanowires, followed by FET fabrication. The devices exhibit excellent electrostatic control, e.g., near ideal subthreshold slope (/spl sim/ 63 mV/dec), low drain-induced barrier lowering (/spl sim/ 10 mV/V), and with I/sub ON//I/sub OFF/ ratio of /spl sim/10/sup 6/. High drive currents of /spl sim/ 1.5 and /spl sim/1.0 mA//spl mu/m were achieved for 180-nm-long nand p-FETs, respectively. It is verified that the threshold voltage of GAA FETs is independent of substrate bias due to the complete electrostatic shielding of the channel body.

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Citations
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Journal ArticleDOI

Modeling stress retarded self-limiting oxidation of suspended silicon nanowires for the development of silicon nanowire-based nanodevices

TL;DR: Hu et al. as discussed by the authors presented a model for the oxidation of silicon nanowires (NWs) based on a modification of the cylindrical Deal and Grove equation and taking into account stress effects associated with non-uniform deformation of the oxide by viscous flow.
Journal ArticleDOI

GaN Nanowire MOSFET With Near-Ideal Subthreshold Slope

TL;DR: These performance metrics make GaN nanowire MOSFETs a promising candidate for emerging low-power applications, such as sensors and RF for the Internet of Things.
Journal ArticleDOI

Electronic level scheme in boron- and phosphorus-doped silicon nanowires.

TL;DR: The first observation of the electronic level scheme in boron (B)- and phosphorus (P)-doped nanowires (NWs) is reported, and it is demonstrated that the doping impurities induce the same shallow levels as in bulk silicon.
Journal ArticleDOI

Silicon nanowire FETs with uniaxial tensile strain

TL;DR: In this paper, the on-current and transconductance gain and mobility enhancement in Si nanowire FETs (NW-FETs) fabricated on silicon-on-insulator (SOI) and biaxially tensile strained SOI (SSOI).
Journal ArticleDOI

Concerning the 506cm−1 band in the Raman spectrum of silicon nanowires

TL;DR: In this article, the Raman spectrum of Si nanowires is compatible with the existence of two distinct phases, namely diamond hexagonal phase (Si-IV) and diamond cubic phase.
References
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Journal ArticleDOI

High Performance Silicon Nanowire Field Effect Transistors

TL;DR: In this article, the influence of source-drain contact thermal annealing and surface passivation on key transistor properties was examined, and it was shown that thermal annaling and passivation of oxide defects using chemical modification can increase the average transconductance from 45 to 800 nS and average mobility from 30 to 560 cm 2 /V
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FinFET-a self-aligned double-gate MOSFET scalable to 20 nm

TL;DR: In this paper, a self-aligned double-gate MOSFET, FinFET was proposed by using boron-doped Si/sub 04/Ge/sub 06/ as a gate material.
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High-performance thin-film transistors using semiconductor nanowires and nanoribbons

TL;DR: It is shown that high-performance TFTs can be produced on various substrates, including plastics, using a low-temperature assembly process and the approach is general to a broad range of materials including high-mobility materials (such as InAs or InP).
Journal ArticleDOI

Double-gate silicon-on-insulator transistor with volume inversion: A new device with greatly enhanced performance

TL;DR: The double-gate control of silicon-on-insulator (SOI) transistors is used to force the whole silicon film (interface layers and volume) in strong inversion as discussed by the authors.
Journal ArticleDOI

Benchmarking nanotechnology for high-performance and low-power logic transistor applications

TL;DR: The results of this benchmarking exercise indicate that while these novel nanoelectronic devices show promise and opportunities for future logic applications, there still remain shortcomings in the device characteristics and electrostatics that need to be overcome.
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