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Journal ArticleDOI

High-performance fully depleted silicon nanowire (diameter /spl les/ 5 nm) gate-all-around CMOS devices

TLDR
In this article, gate-all-around (GAA) n-and p-FETs on a silicon-on-insulator with 5-nm-diameter laterally formed Si nanowire channel were demonstrated.
Abstract
This paper demonstrates gate-all-around (GAA) n- and p-FETs on a silicon-on-insulator with /spl les/ 5-nm-diameter laterally formed Si nanowire channel. Alternating phase shift mask lithography and self-limiting oxidation techniques were utilized to form 140- to 1000-nm-long nanowires, followed by FET fabrication. The devices exhibit excellent electrostatic control, e.g., near ideal subthreshold slope (/spl sim/ 63 mV/dec), low drain-induced barrier lowering (/spl sim/ 10 mV/V), and with I/sub ON//I/sub OFF/ ratio of /spl sim/10/sup 6/. High drive currents of /spl sim/ 1.5 and /spl sim/1.0 mA//spl mu/m were achieved for 180-nm-long nand p-FETs, respectively. It is verified that the threshold voltage of GAA FETs is independent of substrate bias due to the complete electrostatic shielding of the channel body.

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Citations
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Journal ArticleDOI

Drain current characteristics of silicon nanowire field effect transistor

TL;DR: In this article, a simulation study of characteristics of an 11nm Silicon Nanowire Field Effect Transistor (FET) is presented, which is applicable for ultra-scaled devices up to sub-11 nm technology nodes that employ silicon films of a few nm in thickness.
Journal ArticleDOI

Impacts of energy relaxation process on quasi-ballistic hole transport capability in germanium and silicon nanowires

TL;DR: The quasi-ballistic hole transport in germanium and silicon nanowires was theoretically investigated by solving the Boltzmann transport equation taking account of phonon scattering in an atomistic framework as discussed by the authors.
Journal ArticleDOI

Analysis of ballistic and quasi-ballistic hole transport properties in germanium nanowires based on an extended “Top of the Barrier” model

TL;DR: In this paper, the ballistic hole transport properties in rectangular cross-sectional germanium nanowire transistors with various geometries were studied based on the top of the barrier model.
Patent

Method of selectively etching a three-dimensional structure

TL;DR: In this paper, a method of selectively etching a 3D structure includes generating a plasma in contact with the 3-D structure, and illuminating a designated portion of the structure with a laser beam while the plasma is being generated.
Journal ArticleDOI

Impact of Interface Fixed Charges on the Performance of the Channel Material Engineered Cylindrical Nanowire MOSFET

TL;DR: In this article, the effect of hot carrier damage/stress induced damage/process damage/radiation damage induced fixed charges at the semiconductor-oxide interface of the cylindrical nanowire MOSFET was investigated.
References
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Journal ArticleDOI

High Performance Silicon Nanowire Field Effect Transistors

TL;DR: In this article, the influence of source-drain contact thermal annealing and surface passivation on key transistor properties was examined, and it was shown that thermal annaling and passivation of oxide defects using chemical modification can increase the average transconductance from 45 to 800 nS and average mobility from 30 to 560 cm 2 /V
Journal ArticleDOI

FinFET-a self-aligned double-gate MOSFET scalable to 20 nm

TL;DR: In this paper, a self-aligned double-gate MOSFET, FinFET was proposed by using boron-doped Si/sub 04/Ge/sub 06/ as a gate material.
Journal ArticleDOI

High-performance thin-film transistors using semiconductor nanowires and nanoribbons

TL;DR: It is shown that high-performance TFTs can be produced on various substrates, including plastics, using a low-temperature assembly process and the approach is general to a broad range of materials including high-mobility materials (such as InAs or InP).
Journal ArticleDOI

Double-gate silicon-on-insulator transistor with volume inversion: A new device with greatly enhanced performance

TL;DR: The double-gate control of silicon-on-insulator (SOI) transistors is used to force the whole silicon film (interface layers and volume) in strong inversion as discussed by the authors.
Journal ArticleDOI

Benchmarking nanotechnology for high-performance and low-power logic transistor applications

TL;DR: The results of this benchmarking exercise indicate that while these novel nanoelectronic devices show promise and opportunities for future logic applications, there still remain shortcomings in the device characteristics and electrostatics that need to be overcome.
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