Amkor Technology

About: Amkor Technology is a company organization based out in Tempe, Arizona, United States. It is known for research contribution in the topics: Semiconductor package & Substrate (printing). The organization has 1069 authors who have published 1106 publications receiving 26778 citations. The organization is also known as: Amkor & Amkor Technology, Inc..

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.

Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor

Abstract: A semiconductor stacking structure has a semiconductor device. A flexible substrate is coupled to a bottom surface of the semiconductor device. The flexible substrate is folded over on at least two sides to form flap portions. The flap portions are coupled to an upper surface of the first semiconductor device and covers only a portion of the upper surface of the semiconductor device.

Apparatus for electrically mounting an electronic device to a substrate without soldering

Abstract: An apparatus for mounting an electronic device on a substrate without soldering is disclosed. The apparatus includes a body and a plurality of cantilever beams extending from the body. The apparatus is mounted on the substrate. The electronic device is placed within the apparatus. In one embodiment, the cantilever beams press against the electronic device. In another embodiment, the cantilever beams engage the substrate. The apparatus presses an array of electrical contacts of the electronic device (e.g., interconnection balls) against corresponding metal pads of the substrate, thereby forming an electrical connection.

Chamfered memory card module and method of making same

Abstract: A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, multiple side edges, a chamfer extending between a pair of the side edges, a plurality of pads disposed on the lower circuit board surface, and a conductive pattern which is disposed on the upper circuit board surface and electrically connected to the pads. At least one electronic circuit device is attached to the upper circuit board surface and electrically connected to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board and the electronic circuit element such that sections of the upper circuit board surface, including one which extends along the entirety of the chamfer, is not covered by the body.

Flip chip advanced package solder joint embrittlement fault isolation using TDR

Abstract: Time Domain Reflectometry (TDR) is a non-destructive failure analysis technique that identifies the location of an open or short failure. It utilizes a system that sends electrical pulses through the sample and measures the reflected signal. By examining the polarity, amplitude, and other electrical signatures of all reflections, the location of the failure can be easily identified. This is done by comparing the waveform obtained from the device being tested with those obtained from known-good samples. The recent application of TDR on advanced packages has lead to the development of ways or methods to fault isolate flip chip or BGAs, even with low level failure such as solder joint embrittlement. By utilizing TDR, further analysis can be accurately focused on the failing spot and the cause of the failure can be determined efficiently.