Amkor Technology

About: Amkor Technology is a company organization based out in Tempe, Arizona, United States. It is known for research contribution in the topics: Semiconductor package & Substrate (printing). The organization has 1069 authors who have published 1106 publications receiving 26778 citations. The organization is also known as: Amkor & Amkor Technology, Inc..

System and method for compartmental shielding of stacked packages

Abstract: A semiconductor device has a first substrate having a plurality of metal traces. At least one electronic component is electrically attached to a first surface of the first substrate. A second substrate has a plurality of metal traces and attached to the first substrate. At least one electronic component is electrically attached to a first surface of the second substrate. An RF shield is formed on the first substrate to minimizing Electro-Magnetic Interference (EMI) radiation and Radio Frequency (RF) radiation to the at least one electronic component on the first substrate to form an RF shield. A mold compound is used for encapsulating the semiconductor device.

Package in package (PiP)

Abstract: A package includes an internal package stacked upon a primary die. The package includes interconnection balls to allow the package to be electrically and physically connected to a mother board. The package is mounted to the mother board in a single operation thus minimizing labor and the associated manufacturing cost. Further, the package is tested and verified to be non-defective prior to mounting to the mother board.

Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array

Abstract: System-in-package provides highly integrated packaging with high-speed performance Many SiP packages contain low-cost 3D stacked chips interconnected by fine wire bonds In a high-frequency spectrum, these wire bonds can cause discontinuities causing signal degradation This article addresses problems with wire bonding in high-frequency SiP packages and proposes design methodologies to reduce these discontinuities

Semiconductor package structure reducing warpage and manufacturing method thereof

Abstract: An electrical substrate useful for semiconductor packages is disclosed. The electrical substrate includes a core insulative layer. A first surface of the insulative layer has circuit patterns thereon. Some of the circuit patterns are stepped in their heights from the first surface, in that a first subportion of the circuit pattern, including a ball land, extends further from the first surface than a second subportion of the same circuit pattern, and also extends further from the first surface than a ball land of other circuit patterns. Accordingly, solder balls fused to the ball lands of the stepped circuit patterns extend further from the first surface than same-size solder balls fused to the ball lands of the non-stepped circuit patterns, thereby circumventing electrical connectivity problems that may arise from warpage of the electrical substrate.

Effect of joint size and pad metallization on solder mechanical properties

Abstract: Metallurgical analysis, mechanical testing, and finite element analysis were conducted to understand the effect of joint size and pad metallization on solder behavior. A wide range of design and material variables was evaluated. The pad metallization affected both the intermetallic compounds at the joint interfaces and those dispersed in the bulk solder. NiAu pad metallization resulted in more creep resistant joints than Cu. These effects were more pronounced at lower test temperatures. Solder joint creep resistance increased with joint size. Larger joints were also more prone to brittle interface failure than smaller joints. This was true in both package level tests and board level tests. Finite element analysis indicated that the predicted fatigue life in cyclic drop or temperature cycle testing can be significantly affected by the test vehicle used to generate data for constitutive constants. More creep resistant behavior resulted in lower strain and work for both temperature cycle and drop test conditions. When comparing strain vs. work as a damage indicator, it is seen that work is less sensitive to variations in the constitutive constants.