Institution
Amkor Technology
Company•Tempe, Arizona, United States•
About: Amkor Technology is a company organization based out in Tempe, Arizona, United States. It is known for research contribution in the topics: Semiconductor package & Substrate (printing). The organization has 1069 authors who have published 1106 publications receiving 26778 citations. The organization is also known as: Amkor & Amkor Technology, Inc..
Topics: Semiconductor package, Substrate (printing), Die (integrated circuit), Layer (electronics), Flip chip
Papers published on a yearly basis
Papers
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03 Jan 2001TL;DR: In this article, a plurality of pressure sensor dice are attached to an array of die attach sites located on a custom substrate having holes using standard flip chip techniques, and the resulting array of sub-assemblies are then molded, so that a cavity is formed that is open at the bottom of each hole.
Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a custom substrate having holes. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard flip chip techniques. The resulting array of pressure sensor sub-assemblies is then molded, so that a cavity is formed that is open at the bottom of each hole in the custom substrate. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of the hole in the substrate. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the hole. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.
56 citations
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14 Oct 1997TL;DR: In this paper, a thermally enhanced package for an integrated circuit, having a surface with bond pads formed thereon, includes a heat sink structure attached to a central region of the integrated circuit surface inward of the bond pads.
Abstract: A thermally enhanced package for an integrated circuit, the integrated circuit having a surface with bond pads formed thereon, includes a heat sink structure attached to a central region of the integrated circuit surface inward of the bond pads. The package further includes a substrate attached to the heat sink structure. The heat sink structure includes a heat sink and first, second adhesive layers between the heat sink and the integrated circuit, substrate, respectively. The heat sink enhances heat transfer between the integrated circuit and the substrate. Further, the first, second adhesive layers decouple any difference in thermal expansion between the integrated circuit, the heat sink and the substrate.
56 citations
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13 Oct 2000TL;DR: A lead end grid array semiconductor package comprises a leadframe having a plurality of leads The leads extend outwardly from a chip paddle and have an outer end that defines an outer perimeter of the leadframe as mentioned in this paper.
Abstract: A lead end grid array semiconductor package comprises a leadframe having a plurality of leads The leads extend outwardly from a chip paddle and have an outer end that defines an outer perimeter of the leadframe A plurality of inner protrusions and outer protrusions are located on a lower surface of the leads The outer protrusions communicate with the outer perimeter of the leadframe An encapsulating material encapsulates the semiconductor chip and the conductive wires to form the semiconductor package Solder balls are attached to a lower surface of the protrusions The protrusions on the perimeter of the leadframe enable the semiconductor package to be positioned on a flat heat block when affixing the conductive wires to bond pads in the semiconductor chip A ball of conductive material is affixed to the lower end of the protrusions to form a ball grid array
56 citations
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12 Mar 2001TL;DR: In this article, a window is mounted above the micromirror device area and a bead is attached to the upper surface of the micro-drone by a bead to prevent corrosion and contamination.
Abstract: A micromirror device package includes a micromirror device chip having a micromirror device area on an upper surface of the micromirror device chip. A window is mounted above the micromirror device area and to the upper surface of the micromirror device chip by a bead. By forming the window of borosilicate glass and the bead of solder glass, the micromirror device area is hermetically sealed. In this manner, corrosion and contamination of the micromirror device area is prevented.
55 citations
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09 Sep 1997TL;DR: In this paper, an integrated circuit die is affixed to a first surface of the substrate, and is electrically connected to the metallized vias, and a layer of a transparent encapsulating material is deposited onto the die, within the cavity formed by the bead.
Abstract: An integrated circuit package for EPROM, CCD, and other optical integrated circuit devices has a substrate base having metallized vias extending there through. An integrated circuit die is affixed to a first surface of the substrate, and is electrically connected to the metallized vias. An adhesive bead is applied onto the substrate around the die. The bead covers the side surfaces of the die, the periphery of the upper first surface of the die, and the bond wires. The bead and the upper first surface of the die form a cavity above the die. A layer of a transparent encapsulating material is deposited onto the die, within the cavity formed by the bead. The encapsulating material is hardened, and subsequently forms an exterior surface of the package. The transparent encapsulating material allows light of a selected frequency to illuminate the light sensitive circuitry of the die.
55 citations
Authors
Showing all 1070 results
Name | H-index | Papers | Citations |
---|---|---|---|
Thomas P. Glenn | 48 | 130 | 6676 |
Dong-Hoon Lee | 48 | 762 | 23162 |
Joungho Kim | 40 | 579 | 7365 |
Steven Webster | 34 | 83 | 3322 |
Young Bae Park | 33 | 216 | 4325 |
Roy Dale Hollaway | 28 | 53 | 2324 |
Ronald Patrick Huemoeller | 26 | 91 | 2385 |
Robert Francis Darveaux | 23 | 70 | 1881 |
MinJae Lee | 23 | 99 | 3083 |
Il Kwon Shim | 21 | 41 | 1403 |
Vincent DiCaprio | 20 | 27 | 1973 |
Sukianto Rusli | 19 | 44 | 1308 |
Glenn A. Rinne | 19 | 34 | 898 |
Ahmer Syed | 18 | 55 | 1192 |
David Jon Hiner | 18 | 54 | 1173 |