Amkor Technology

About: Amkor Technology is a company organization based out in Tempe, Arizona, United States. It is known for research contribution in the topics: Semiconductor package & Substrate (printing). The organization has 1069 authors who have published 1106 publications receiving 26778 citations. The organization is also known as: Amkor & Amkor Technology, Inc..

Lead frame and semiconductor package with radiation fin using the same

Abstract: PURPOSE: A lead frame and a semiconductor package with a radiation fin using the same are provided to control the flow of a packing material by handling properly an interval between inner leads. CONSTITUTION: A lead frame comprises a rectangle-shaped space portion for locating a semiconductor chip(28) and a multitude of inner lead(4) around the space portion. The lead frame further comprises a packing material injection area(12) for receiving the packing material. A semiconductor package with a radiation fin using the same comprises a radiation fin(22), a semiconductor chip, a multitude of inner lead and outer lead(7), a conductive wire(30), and a body(32). The radiation fin has a rectangle shape. The semiconductor chip is adhered on a center portion of the radiation fin. The inner lead and the outer lead are adhered on the radiation fin. The conductive wire connects the inner lead with the semiconductor chip. The body is formed by packing the radiation fin, the semiconductor chip, the inner lead and the conductive wire.

High density memory card using folded flex

Abstract: A memory card comprising a flexible substrate (a “flex”) which is integrated in the memory card and folded in a prescribed manner subsequent to having various active and passive devices (e.g., controller and memory devices) surface mounted thereto. The active and passive devices are attached to a common side of the flex, and electrically connected to a conductive pattern disposed thereon. The conductive pattern itself electrically communicates with external signal contacts also formed on the flex. The use of folded flex technology in the memory card of the present invention allows the same to support four or more standard, pre-packaged memory devices, thus providing the memory card with substantially increased capacity.

Electronic package structure having exposed lands and method

Abstract: In one embodiment, a semiconductor device includes a leadframe structure. A semiconductor die is attached to a die pad. Land connect bars are spaced apart from the die pad and a plurality of lands are between the land connect bars and the die pad and are spaced apart therefrom. Insulation members are adhered to the land connect bars and the plurality of lands to hold the land connect bars and the plurality of lands together and to electrically isolate them. An encapsulant covers the semiconductor die and at least portions of the plurality of lands, the die pad, and the land connect bars and further fills spaces between the land connect bars and the plurality of lands.

Semiconductor package using a polymer substrate

Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.

Encapsulated semiconductor package and method of manufacturing thereof

Abstract: Encapsulated semiconductor packages and methods of production thereof. As a non-limiting example, a semiconductor package may be produced by partially dicing a wafer, molding the partially diced wafer, and completely dicing the molded and partially diced wafer.