Amkor Technology

About: Amkor Technology is a company organization based out in Tempe, Arizona, United States. It is known for research contribution in the topics: Semiconductor package & Substrate (printing). The organization has 1069 authors who have published 1106 publications receiving 26778 citations. The organization is also known as: Amkor & Amkor Technology, Inc..

Semiconductor package using a printed circuit board and a method of manufacturing the same

Abstract: A semiconductor package has a substrate comprising a thermosetting resin layer of an approximate planar plate, a plurality of copper patterns formed at top and bottom surfaces of the resin layer, and protective layers coated on predetermined regions of the copper patterns and the thermosetting layer and having a same height at a surface of the resin layer. A semiconductor die is coupled to a center of the top surface of the substrate. A plurality of conductive wires for electrically coupling the semiconductor die to the copper patterns is positioned at the top surface of the resin layer. An encapsulant is used for covering the semiconductor die located at the top surface of the substrate and the conductive wires in order to protect them from the external environment. A plurality of solder balls is coupled to the bottom surface of the substrate.

Image sensor package having optical element

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Grid array type lead frame having lead ends in different planes

Abstract: The invention relates to a grid array type lead frame having a plurality of leads classified into groups by length. The leads extend to respective lead ends, in each of which at least one different plane direction-converting lead part and/or at least one identical plane direction-converting lead part is formed by at least one bending part, whereby the lead ends are distributed in a grid array. The invention also includes a grid array type lead frame, which is as small as or similar to that of semiconductor chip in area while the lead ends are arrayed on one plane, and are at a farther distance away from neighboring ones but in a higher number per area, in such a manner that they form a grid array.

Methods of forming bumps using barrier layers as etch masks and related structures

Abstract: Forming an electronic structure may include forming a seed layer on a substrate, and forming a mask on the seed layer. The mask may include an aperture therein exposing a portion of the seed layer, and a barrier layer may be formed on the exposed portion of the seed layer. A bump may be formed on the barrier layer, and the mask may be removed. In addition, portions of the seed layer may be selectively removed using the barrier layer as an etch mask.

Stack-type semiconductor package and manufacturing method thereof

Abstract: A stack-type semiconductor package includes a first semiconductor package upon which a second semiconductor package is stacked. A layer of a hardened, insulative material, e.g., a no-flow underfill (NUF) material, is disposed between, and mechanically couples the stacked first and second semiconductor packages. The NUF layer covers portions of the first semiconductor package, e.g., the semiconductor die and the substrate of the first semiconductor package, and solder balls of the second semiconductor package that are fused to the substrate of the first semiconductor package. The NUF material is applied onto the semiconductor die and substrate of the first semiconductor package before the second semiconductor package is stacked on the first semiconductor package, and substantially cures after the solder balls of the second semiconductor package are fused to the substrate of the first semiconductor package.