Amkor Technology

About: Amkor Technology is a company organization based out in Tempe, Arizona, United States. It is known for research contribution in the topics: Semiconductor package & Substrate (printing). The organization has 1069 authors who have published 1106 publications receiving 26778 citations. The organization is also known as: Amkor & Amkor Technology, Inc..

Limitations of Norris-Landzberg equation and application of damage accumulation based methodology for estimating acceleration factors for Pb free solders

Abstract: With the increasing use of Pb free solder in Electronic assemblies the estimation of their reliability under field use conditions is becoming important. The acceleration factor for solder depends on delta T, dwell times, ramp rates, actual values of temperature extremes, and the type of package. During the last few years, a number of papers have been published to determine the acceleration factors using Norris-Landzberg equation by varying some of these parameters. However, no consistent Norris-Landzberg parameters have been found yet for SnAgCu solders. This paper seeks to relate the field life with accelerated life by using simulations and a damage accumulation methodology. It is shown that the damage accumulation process in solder joints is much more complex to be captured by a simplified equation, such as Norris-Landzberg equation. The data presented here also shows that the acceleration factors depend on the package type and basing reliability requirement on accelerated test conditions, e.g., 1000 cycles for −40 to 125°C, irrespective of package type might preclude a package for a certain application even though the package might pass field level reliability requirements.

Bump chip scale semiconductor package

Abstract: A bump chip scale semiconductor package. In the bump chip scale semiconductor package, the chip bumps are directly formed on the chip pads of a semiconductor chip. The above chip bumps are used as the signal input and output terminals of the package and are used as surface mounting joints when the chip is mounted to a mother board.

Injection molded lens-barrel assembly and method for fabricating lens-barrel and mount assemblies

Abstract: An injection molded lens-barrel assembly and method for fabricating lens-barrel and mount assemblies provides a low cost precision optical front end for digital cameras A barrel is injection-molded around a lens, securing the lens in place Alternatively, the lens-barrel assembly may be injection molded in one molding stage having two steps A transparent material is injected to form a lens and an opaque compatible material is injected to form the barrel, yielding a single part that may be mounted to a digital camera Multiple lens assemblies may be produced by incorporating an alignment feature on each lens to hold the lenses in an external mold fixture One or more supporting structures are then molded around the multiple lenses, securing them in mechanical alignment

Thermoplastic semiconductor package

Abstract: A semiconductor package includes a lead frame with a die or chip mounted on a die pad, a base made of a thermoplastic material and having a cavity, and a lid made of thermoplastic material ultrasonically welded to the base to cover the cavity and protect the electronic device in the package. The package may include a substrate with conductive traces. A method of attaching a lid to a semiconductor package base includes the steps of providing a semiconductor package base having an open cavity, providing a thermoplastic lid that covers the open cavity, placing the lid on the semiconductor package base so that the lid covers the open cavity, applying pressure to hold the lid and body together, and attaching the lid to the base by ultrasoncially welding them together.

Printed circuit board for ball grid array semiconductor package

Abstract: A printed circuit board for a BGA semiconductor package provided at one corner thereof with a degating opening serving as a mold runner gate during a process of molding a resin seal adapted to protect the semiconductor chip and serving as a region for degating a surplus resin formed after the molding process and a method for molding a BGA semiconductor using the printed circuit board. The degating opening has an inverted triangular shape having curved lateral sides and a vertex, at which the lateral sides join together, disposed in a region for forming the resin seal, or an inverted trapezoidal shape having one end disposed in the resin seal region. The invention can eliminate the peeling or damage of the upper surface of the printed circuit board occurring upon degating a surplus resin, the damage of the printed circuit board due to a torsion thereof, the damage of conductive traces on the printed circuit board, the exposure of the conductive traces caused by the damage of a solder mask, and the damage of a resin seal on the printed circuit board. Therefore, an improvement in productivity and reliability is achieved.