Amkor Technology

About: Amkor Technology is a company organization based out in Tempe, Arizona, United States. It is known for research contribution in the topics: Semiconductor package & Substrate (printing). The organization has 1069 authors who have published 1106 publications receiving 26778 citations. The organization is also known as: Amkor & Amkor Technology, Inc..

Blind via capture pad structure

Abstract: A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture pad, a focused laser beam is moved linearly to form linear channels in the dielectric layer. These channels are filled with an electrically conductive material to form the capture pad.

Integrated circuit package employing a transparent encapsulant and a method of making the package

Abstract: An integrated circuit package for EPROM, CCD, and other optical integrated circuit devices has a substrate base having metallized vias extending therethrough. An integrated circuit die is affixed to a first surface of the substrate, and is electrically connected to the metallized vias. An adhesive bead is applied onto the substrate around the die. The bead covers the side surfaces of the die, the periphery of the upper first surface of the die, and the bond wires. The bead and the upper first surface of the die form a cavity above the die. A layer of a transparent encapsulating material is deposited onto the die, within the cavity formed by the bead. The encapsulating material is hardened, and subsequently forms an exterior surface of the package. The transparent encapsulating material allows light of a selected frequency to illuminate the light sensitive circuitry of the die.

Tree watering device

Abstract: A tree watering device suitable for indicating the level of water pooled near the trunk of the tree for hydrating purposes. In one embodiment, the device comprises a hollow conduit with a perforated end cap on one end and a funnel on the other. The device also comprises a float positioned within the conduit and a rod attached to the float. The float rises and falls within the conduit as the level of the water pooled near the trunk rises and falls. As a result of the float's movement, the rod rises and falls, thereby indicating the level of water hydrating the tree. Due to the length of the device, a user may fill it without excessive bending or reaching, and the funnel inhibits spillage of water when filling the device. Also, the end cap inhibits clogging of the device.

Manufacturing method for leadframe and for semiconductor package using the leadframe

Abstract: In accordance with the present invention, there is provided a method for manufacturing a leadframe. The method comprises the initial step of bonding a primary leadframe to an adhesive tape layer, the primary leadframe including a die paddle and a plurality of leads which extend at least partially about the die paddle in spaced relation thereto. Thereafter, a photo resist is applied to the primary leadframe and to the adhesive tape layer. The photo resist is then patterned to define at least one exposed area in each of the leads of the primary leadframe. The exposed areas of the leads are then etched to divide the leads into an inner set which extends at least partially about the die paddle and an outer set which extends at least partially about the inner set. Thereafter, the photo resist is removed from the die paddle and from the inner and outer sets of the leads.

Pre-drilled image sensor package

Abstract: An image sensor package includes a substrate having a central aperture. Electrically conductive traces on a lower surface of the substrate include tabs projecting below and under hanging the central aperture. An image sensor is flip chip mounted to the tabs and thus supported in the central aperture by the tabs. By mounting the image sensor in the central aperture, the resulting image sensor package is relatively thin.