Agilent Technologies

About: Agilent Technologies is a company organization based out in Santa Clara, California, United States. It is known for research contribution in the topics: Signal & Mass spectrometry. The organization has 7398 authors who have published 11518 publications receiving 262410 citations. The organization is also known as: Agilent Technologies, Inc..

Fixed-focus camera module and associated method of assembly

Abstract: A fixed-focus camera module includes an image sensor, a lens for focusing an image onto the image sensor, and a positioning structure for maintaining an alignment of the lens and image sensor. The alignment provides a desired image quality of the image focussed onto the image sensor. The positioning structure includes a first unthreaded member coupled to the lens and a second unthreaded member coupled to the image sensor. One of the first and the second members is configured to be inserted into the other of the members to provide an adjustable relative position of the lens and the image sensor.

Integrated circuit packaging for optical sensor devices

Abstract: An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate. In the embodiment, contact pads of the first substrate are flip chip bonded to contact pads of the circuit board with conductive balls. The connection between the first substrate and the circuit board provides the electrical connection between the optical sensor and the circuit board.

Color image sensor with imaging elements imaging on respective regions of sensor elements

Abstract: The color image sensor (100) generates an image signal (114) representing a subject. The color image sensor has a light sensor (112) and imaging elements (101, 102, 103) arranged to form images of the subject in light of different colors on respective regions (131, 132, 133) of the light sensor. The light sensor includes sensor elements (e.g., 121) and is operable to generate the image signal in response to light incident on it.

Methods and apparatus for dual-boot memory selection, update, and recovery in a programmable device

Abstract: Methods and associated apparatus for using a dual-boot capable programmable device and for updating programmed information in such a dual-boot capable programmable device. The apparatus of the present invention includes a primary boot memory device (108), a secondary boot memory device (110), and means for selecting between the two memory devices for purposes of "booting" the dual-boot mode device (100, 114..122). In particular, a reset switch (122) of the apparatus of the present invention resets devices in the dual-boot capable programmable device and is coupled to a selection device (114..120). The selection device (114..120) multiplexes signals from the two boot memory devices onto the corresponding bus signals of the dual-boot capable programmable device. When a "long" reset switch activation is sensed (118), the selection device selects a first of the two boot memory devices for coupling to the programmable device. A "short" activation (120) of the reset switch selects the other boot memory device. The present invention also includes methods (200..214, 400..410) for updating the contents of the two boot memory devices so as to avoid an inoperable state encountered due to failure of the update process in a single boot memory device. In particular, both boot memory devices are updated in sequence. The second memory update (206..214) is prevented if the first memory update (200..202) is determined to have failed (204).