O
Oliver Ambacher
Researcher at Fraunhofer Society
Publications - 862
Citations - 29006
Oliver Ambacher is an academic researcher from Fraunhofer Society. The author has contributed to research in topics: Amplifier & Monolithic microwave integrated circuit. The author has an hindex of 64, co-authored 848 publications receiving 26256 citations. Previous affiliations of Oliver Ambacher include Osram & Siemens.
Papers
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Journal ArticleDOI
Piezoelectric actuated epitaxially grown AlGaN/GaN‐resonators
F. Niebelschuetz,K. Brueckner,Katja Tonisch,Ralf Stephan,Volker Cimalla,Oliver Ambacher,Matthias Hein +6 more
TL;DR: In this article, the authors presented a novel concept of piezoelectrically actuated MEMS resonators based on AlGaN/GaN-heterostructures.
Journal ArticleDOI
AlGaN/GaN-sensors for Monitoring of Enzyme Activity by pH-Measurements
G. Kittler,A. Spitznas,Benedikt Luebbers,Vadim Lebedev,Dennis Wegener,Michael Gebinoga,Frank Weise,Andreas Schober,Oliver Ambacher +8 more
TL;DR: In this article, a pH-sensors were used to measure the reaction and kinetics of a lipase assay producing caprylic acid using a thin GaN cap layer.
Proceedings ArticleDOI
A GaN-based Current Sense Amplifier for GaN HEMTs with Integrated Current Shunts
Michael Basler,Stefan Moench,Richard Reiner,Patrick Waltereit,Rudiger Quay,Ingmar Kallfass,Oliver Ambacher +6 more
TL;DR: In this article, a two-stage GaN-based current sense amplifier was proposed for a power GaN HEMT with integrated current shunt, achieving a gain of 40 dB at room temperature.
Proceedings ArticleDOI
Low-power wireless data transmitter MMIC with data rates up to 25 Gbit/s and 9.5mW power consumption using a 113 GHz carrier
TL;DR: A low-power wireless data transmitter MMIC at 113 GHz with data rates up to 25 Gbit/s is presented, based on a 50nm InGaAs metamorphic HEMT technology.
Proceedings ArticleDOI
Reverse bias stress test of GaN HEMTs for high-voltage switching applications
Michael Dammann,Heiko Czap,J. Ruster,M. Baeumler,F. Gutle,Patrick Waltereit,Fouad Benkhelifa,Richard Reiner,M. Casar,Helmer Konstanzer,Stefan Müller,Rudiger Quay,Michael Mikulla,Oliver Ambacher +13 more
TL;DR: In this article, the degradation of packaged GaN HEMTs for high power applications has been studied under long term reverse bias step stress tests, and the degradation is possibly caused by the formation of localized defects which have been observed by backside electroluminescence imaging.