Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

Mobile device and method for intelligently communicating data generated thereby over short-range, unlicensed wireless networks and wide area wireless networks

Abstract: A mobile device is provisionable for service on a wireless wide area network (WWAN) operated by a licensed network operator and is further operable on at least one shorter-range, unlicensed wireless network (UWN). The mobile device stores applications that generate data when executed, including at least one application that generates data for communication over the WWAN. The mobile device executes a stored application and classifies data generated by the executed application into one of at least two categories based upon a domain of a target network to which the data is to be sent. A first category relates to data requiring communication at least partially over the WWAN and a second category relates to data not requiring communication over the WWAN. The mobile device establishes communication with a target device in the target network over at least the UWN based upon classification of the data generated by the executed application.

Pad array semiconductor device

Abstract: Pad array carriers allow greater I/O densities over conventional leaded packages by using an array arrangement for external electrical connections. A pad array carrier (48) is manufactured using a substrate (40) having metal on only one side and unplated through-holes (44). A semiconductor die (50) is mounted on and affixed to the top surface of the substrate with an electrically insulative adhesive (51). The use of the insulative adhesive allows routing of signal traces into the die mounting region directly underneath the die. Wire bonds (52) connect the die to metal traces (46) on the substrate. A package body (54) is formed on the substrate covering the die and wire bonds (52). Solder balls (56 & 58) are directly attached to the backside of the solder pads (47) by way of the through-holes.

Improved stability analysis and gain-scheduled controller synthesis for parameter-dependent systems

Abstract: We present new algorithms for robust stability analysis and gain-scheduled controller synthesis for linear systems affected by time-varying parametric uncertainties. These new techniques can also be applied to parameter-dependent nonlinear systems with real-rational nonlinearities. Sufficient conditions for robust stability, as well as conditions for the existence of a robustly stabilizing gain-scheduled controller, are given in terms of a finite number of linear matrix inequalities (LMIs); explicit formulas for constructing robustly stabilizing gain-scheduled controllers are given in terms of the feasible set of these LMIs. The improvement offered by our approach over existing methods for stability analysis and gain-scheduled controller synthesis for parameter-dependent linear systems are analyzed in theory. Numerical examples demonstrate that our approach can offer significant improvement in practice.

Leadless integrated circuit package

Abstract: A semiconductor device package comprises an integrated circuit chip (10), a substrate (16), an encapsulant (30), and an organic coupling agent or underfill material (12) disposed between the integrated circuit chip and the first side of the substrate. The chip has a plurality of interconnection pads (14) disposed on an active surface of the chip at some minimum spacing "X." Each of the interconnect pads also has electrically conducting bumps (26) on them. The substrate has a circuit pattern (20) on a first side and an array of solder pads (23) spaced a certain distance apart on an opposite side of the substrate. The distance between these pads is greater than the minimum distance (X) between the interconnect pads on the IC. The circuit pattern is electrically connected to the array of solder pads by plated through holes (22). The length and width of the circuit carrying substrate is substantially greater than the length and width of the integrated circuit chip. The chip is mounted face down to the substrate with the electrically connecting bumps, such that at least some of the plated through holes in the substrate are covered by the chip. The polymeric encapsulant (30) covers the entire chip and substantially all of the first side of the substrate, providing a sealed package.

Registration of radiotelephones in networked cellular radiotelephone systems

Abstract: Adjacent cellular systems (101-103) are interconnected to form a network providing telephone coverage to mobiles located throughout their combined coverage areas (111-113). Each networked cellular system (101-103) includes base sites (412, 414, 416) located in cells (402, 404, 406) and a control terminal (420) coupled by data and voice lines to the base sites, a telephone central office (422) and the other cellular systems. Each base site (412, 414, 416) includes a base site controller (950), a scanning receiver (910), signalling transceiver (912) and up to eight voice channel transceivers (901-908). As mobiles move about the networked coverage area (111-113), intrasystem handoffs are provided between cells of the same cellular system, and intersystem handoffs are provided between border cells of adjacent cellular systems. Mobiles are paged throughout the networked coverage area (111-113) in the paging area (121-136) in which the mobile last registered. Registration parameters are updated by the control terminal (420) and base sites (412, 414, 416) and sent to mobiles in the overhead message train. Mobiles automatically register in response to receipt of the overhead message train when moving between paging areas (121-136) according to the flow charts of Figures 5 and 6.