Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

VBIC95, the vertical bipolar inter-company model

Abstract: This paper details the VBIC95 bipolar junction transistor (BJT) model. The model was developed as an industry standard replacement for the SPICE Gummel-Poon (SGP) model, to improve deficiencies of the SGP model that have become apparent over time because of the advances in BJT process technology. VBIC95 is still based on the Gummel-Poon formulation, and thus can degenerate to be similar to the familiar SGP model. However, it includes improved modeling of the Early effect, quasi-saturation, substrate and oxide parasitics, avalanche multiplication, and temperature behavior that can be invoked selectively based on model parameter values.

Method and apparatus for relay facilitated communications

Abstract: Communications sourced by a remote unit (14) that is already within reception range of a base site (10) can nevertheless be further facilitated through allocation of one or more relay resources (15, 16). Such relay resources, properly employed, then serve to effectively increase the quality of service for the facilitated communication. This, in turn, can permit the use of, for example, increased data rates for communications from a relatively low power remote unit.

Inverted oleds on hard plastic substrate

Abstract: A hard plastic card display device including a hard plastic card having a major surface and a driver circuit. A display, including a plurality of inverted organic light emitting diodes, is formed on the major surface and coupled to the driver circuit.

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

Abstract: Intermetallic compound (IMC) growth during solid-state aging at 125, 150, and 170 °C up to 1500 h for four solder alloys (eutectic SnPb, Sn–3.5Ag, Sn–3.8Ag–0.7Cu, and Sn–0.7Cu) on Cu under bump metallization was investigated. The samples were reflowed before aging. During the reflow, the solders were in the molten state and the formation of the IMC Cu6Sn5 in the cases of eutectic SnPb and Sn–3.5Ag had a round scallop-type morphology, but in Sn–0.7Cu and Sn–3.8Ag–0.7Cu the scallops of Cu6Sn5 were faceted. In solid-state aging, all these scallops changed to a layered-type morphology. In addition to the layered Cu6Sn5, the IMC Cu3Sn also grew as a layer and was as thick as the Cu6Sn5. The activation energy of intermetallic growth in solid-state aging is 0.94 eV for eutectic SnPb and about 1.05 eV for the Pb-free solders. The rate of intermetallic growth in solid-state aging is about 4 orders of magnitude slower than that during reflow. Ternary phase diagrams of Sn–Pb–Cu and Sn–Ag–Cu are used to discuss the reactions. These diagrams predict the first phase of IMC formation in the wetting reaction and the other phases formed in solid-state aging. Yet, the morphological change and the large difference in growth rates between the wetting reaction and solid-state aging cannot be predicted.

Smart card with contactless optical interface

Abstract: An optical smart card (10) including a microchip (14) having information stored thereon, an optical holographic sensor pad (16) capable of detecting and collecting light beams emitted from a remote reader/transmitter (52), a light source (18) capable of emitting dataelectronic information contained on the microchip (14) back to the remote reader/transmitter (52) and electronics (20) connected to the sensor pad (16), the light source (18) and the microchip (14).