Institution
Motorola
Company•Schaumburg, Illinois, United States•
About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.
Papers published on a yearly basis
Papers
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12 Jul 2000
TL;DR: In this paper, a method of fabricating a semiconductor structure including the steps of providing a silicon substrate (10) having a surface, forming on the surface of the silicon substrate, by atomic layer deposition (ALD), a seed layer (20;20') characterised by a silicate material and forming, by ALD, one or more layers of a high dielectric constant oxide (40) on the seed layer.
Abstract: A method of fabricating a semiconductor structure including the steps of providing a silicon substrate (10) having a surface (12), forming on the surface (12) of the silicon substrate (10), by atomic layer deposition (ALD), a seed layer (20;20') characterised by a silicate material and forming, by atomic layer deposition (ALD) one or more layers of a high dielectric constant oxide (40) on the seed layer (20;20').
368 citations
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31 Oct 2007TL;DR: In this article, the authors describe methods and devices for automatically coupling two or more mobile communication devices (502, 541) to share content such as calls, music, documents, video and games.
Abstract: Described are methods and devices for automatically coupling two or more mobile communication devices (502, 541) to share content such as calls, music, documents, video and games where two or more devices automatically determine the feasibility of sharing the content and negotiate to find an efficient manner in which to do so In this way, the pairing between devices may be transparent to the users Moreover, a better choice in a transport may be selected without user input Each device may include a near field communication (NFC) device that when in range of the other device may automatically initiate pairing between the devices so that the devices may share content The users of NFC enabled devices may have little or minimal interactions except that one or more users may bring the devices within range so that the NFCs may initiate the pairing between the devices
365 citations
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09 Apr 1990TL;DR: In this article, a lithium battery includes a switch (22) to activate the discharging circuit (18) so that lithium may be inactivated for safe disposal of the battery.
Abstract: A lithium battery (10) includes a switch (22) to operatively activate the discharging circuit (18) so that lithium may be inactivated for safe disposal of the battery (10).
361 citations
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11 Sep 1995TL;DR: An enhanced mobility MOSFET device (10) comprises a channel layer (12) formed on a monocrystalline silicon layer (11), which is an alloy of silicon and a second material with the second material substitutionally present in silicon lattice sites at an atomic percentage that places the channel layer under a tensile stress as mentioned in this paper.
Abstract: An enhanced mobility MOSFET device (10) comprises a channel layer (12) formed on a monocrystalline silicon layer (11). The channel layer (12) comprises an alloy of silicon and a second material with the second material substitutionally present in silicon lattice sites at an atomic percentage that places the channel layer (12) under a tensile stress.
360 citations
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15 Jul 1992TL;DR: A pad array semiconductor device as mentioned in this paper includes a thermal conductor integrated into a circuitized substrate and a semiconductor die mounted on the substrate overlying the thermal conductor to establish a thermal path away from the die.
Abstract: A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal conductor to establish a thermal path away from the die. The thermal conductor may also be covered or surrounded by a metallized area (37, 39), which together may serve as a ground plane in the device. Preferably one or more terminals (26) are attached to the thermal conductor for improved thermal and electrical performance. One method of integrating the thermal conductor in the substrate is to position a metal plug into an opening 30 of the substrate. The plug is then compressed or otherwise plastically deformed to fill the opening and create a substantially planar substrate surface.
359 citations
Authors
Showing all 27298 results
Name | H-index | Papers | Citations |
---|---|---|---|
Georgios B. Giannakis | 137 | 1321 | 73517 |
Yonggang Huang | 136 | 797 | 69290 |
Chenming Hu | 119 | 1296 | 57264 |
Theodore S. Rappaport | 112 | 490 | 68853 |
Chang Ming Li | 97 | 896 | 42888 |
John Kim | 90 | 406 | 41986 |
James W. Hicks | 89 | 406 | 51636 |
David Blaauw | 87 | 750 | 29855 |
Mark Harman | 83 | 506 | 29118 |
Philippe Renaud | 77 | 773 | 26868 |
Aggelos K. Katsaggelos | 76 | 946 | 26196 |
Min Zhao | 71 | 547 | 24549 |
Weidong Shi | 70 | 528 | 16368 |
David Pearce | 70 | 342 | 25680 |
Douglas L. Jones | 70 | 512 | 21596 |