Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

Leadless semiconductor device and method for making the same

Abstract: A semiconductor device having a thin package profile is leadless, thereby minimizing necessary mounting space on a substrate. In one form, a semiconductor device has a semiconductor die electrically coupled to a plurality of conductive leads. Each lead has a first portion, a second portion, and an intermediate portion which separates the first and second portions. A package body encapsulates the semiconductor die and the first and intermediate portions of the leads. The second portions of the leads are exposed on the bottom surface of the package body and are used to electrically access the semiconductor die.

A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface

Abstract: A novel technique for suppressing power plane resonance at microwave and radio frequencies is presented. The new concept consists of replacing one of the plates of a parallel power plane pair with a high impedance surface or electromagnetic band gap structure. The combination of this technique with a wall of RC pairs extends the lower edge of the effective bandwidth to dc, and allows resonant mode suppression up to the upper edge of the band-gap. The frequency range for noise mitigation is controlled by the geometry of the HIGP structure.

Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film

Abstract: A low cost manufacturing method is used to fabricate a small multichip semiconductor device (30). In one embodiment, a pattern of conductive traces (13) is formed on a film of transfer material (12). A first semiconductor die (15) is interconnected to the traces and a resin body (20) is formed around the first die and one side of the traces. The film of transfer material forms, at this stage of the process, one side of the first package. The film of transfer material is then peeled from the pattern of conductive traces and the first resin body to expose the other side of the traces. A second semiconductor die (23) is interconnected to the exposed side of the traces. A second resin body (25) is formed around the second die and portions of the exposed traces. Solder balls (26) are coupled to the exposed portions of the traces to establish external electrical connections to each die.

Interactive wireless gaming system

Abstract: An interactive wireless gaming system has a plurality of wireless gaming units which operate alternately as a host device. The wireless gaming units include a receiver for receiving wireless messages including gaming information which provides periodically update data signals generated by the gaming units to indicate a present position of a plurality of moveable objects moving. A display displays the gaming information in a form of graphic characterizations depicting the moveable objects. A processor generates the updated gaming information, and includes a memory for storing the data signals; a decoder for generating control signals in response to the gaming information received; a controller responsive to the control signals for effecting sequential storage of the data signals and a recall of a last of the data signals stored for display; and a network interface coupled between the controller and the game server. A transmitter transmits wireless responses to provide the updated gaming information.

Carrier Aggregation in LTE-Advanced

Abstract: UMTS LTE system can support flexible bandwidth configuration up to 20 MHz. Currently, system enhancements are being considered to provide substantial improvements to LTE and allow it to meet or exceed IMT-Advanced requirements. One key enhancement feature is bandwidth extension via carrier aggregation to support deployment bandwidth up to 100 MHz. This will allow peak target data rates in excess of 1 Gbps in the downlink and 500 Mbps in the uplink to be achieved. Carrier aggregation is attractive because it allows operators to deploy a system with larger bandwidth by aggregating several smaller contiguous or non-contiguous carriers while providing backward compatibility to legacy users. For instance, an 80MHz system can be constructed using contiguous or non-contiguous 4×20MHz component carriers. Legacy users can then access the system using one of the component carriers. This paper provides an overview of carrier aggregation and discusses major technical issues including aggregation structure, scenarios, implementation, control signalling design and coexistence with legacy LTE systems.