Panasonic

About: Panasonic is a company organization based out in Kadoma, Ôsaka, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 49129 authors who have published 71118 publications receiving 942756 citations. The organization is also known as: Panasonikku Kabushiki-gaisha & Panasonic.

Organic electroluminescent device and method for manufacturing the same

Abstract: An organic EL device which drives over a wide range from low brightness to high brightness for light source applications, operates stably over a wide range of brightness and has excellent life property is provided. The device comprises at least one pair of electrodes 2 and 5, and a plurality of functional layers disposed between the electrodes 2 and 5, the functional layers comprising a layer 4 having the light emitting function, which is composed of at least one polymeric material and contains an organic solvent and a charge injection layer 3 composed of at least one inorganic material.

Semiconductor light emitting device, light emitting module, and lighting apparatus

Abstract: An LED array chip (2) includes blue LEDs (6) and red LEDs (8) The blue LEDs (6) are formed by epitaxial growth on an SiC substrate (4) Bonding pads (46 and 48) are formed on the SiC substrate (4) in a wafer fabrication process The red LEDs (8) are separately manufactured from the blue LEDs (6) , and flip-chip mounted on the bonding pads (46 and 48) formed on the SiC substrate

Semiconductor light-emitting device and manufacturing method of the same

Abstract: Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices. Thus, a semiconductor light-emitting device having a reflective layer on its side surfaces can be obtained.

Electrical contact bump and a package provided with the same

Abstract: A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conductive adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

Push-on switch

Abstract: The first movable contact including a ring portion and projections extended in same width as the ring is arranged against the peripheral fixed contacts and the central fixed contact at the bottom of the switch case in such manner that the ring portion confronts the peripheral fixed contacts at spaced intervals apart.