Panasonic

About: Panasonic is a company organization based out in Kadoma, Ôsaka, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 49129 authors who have published 71118 publications receiving 942756 citations. The organization is also known as: Panasonikku Kabushiki-gaisha & Panasonic.

Multimedia optical disk, reproduction apparatus and method for achieving variable scene development based on interactive control

Abstract: A multimedia optical disk is provided. The multimedia optical disk includes a data area for storing objects which include moving picture data and at least one of audio data and sub-picture data. The multimedia optical disk also includes an index area for storing reproduction orders of the objects. Route information in the index area includes a sequence of addresses of objects whose alignment represents a reproduction order. Chain control information in the index area corresponds to the route information. The chain control information, being effective in reproducing objects specified by the alignment of the sequence of addresses (objects specified by the alignment of the sequence of addresses are called a chain), instructs the reproduction apparatus to have a navigation control of the chain. A piece of moving picture data having a certain time period is reproduced at the same timing as a piece of audio data and a piece of sub-picture data. A piece of sub-control information, being effective in reproducing moving picture data, sub-picture data, and audio data stored in a small unit instructs the reproduction apparatus to have a navigation control of the data stored in the same small unit.

Information recording medium and apparatus and method for recording and reproducing information

Abstract: The data recording/reproducing apparatus of the present invention efficiently performs a trickplay mode operation such as fast forward reproducing and rewind reproducing and a postrecording operation by using a data recording medium storing a variable-bitrate-compressed video data. Each AV file in the video data includes chapter data and first and second pointer data. Each GOP data in the chapter data includes one independent picture data and a plurality of dependent picture data. The first pointer data includes the location data of the independent picture data, and the second pointer data includes the location data of the first pointer data. Further, each GOP data includes an audio data interleaved with the picture data. The first pointer data includes the location data of the corresponding audio data, and the second pointer data includes the location data of the corresponding first pointer data. A hierarchical location data for retrieving the independent picture data and/or the audio data is formed by the first and second pointers.

Apparatus and method for mounting a chip

Abstract: An apparatus and a method for mounting a chip make it possible to accomplish quick chip mounting and also to mount multiple different chips on substrates. Three heads are provided around a center rod of a head assembly; they horizontally rotate around the center rod. When the heads rotate horizontally, they are turned 180 degrees vertically by a first bevel gear and a second bevel gear. A nozzle of one of the heads picks up a flip chip from a wafer sheet and rotates 180 degrees horizontally to transfer the flip chip to a transferring head, during which it vertically inverts 180 degrees so as to vertically invert the flip chip. The transferring head receives the flip chip from the head and mounts it on a substrate. According to the type of chips to be mounted, the heads and the transferring head are equipped with nozzles best suited for the type of chips.

Semiconductor device and method of manufacturing the same

Abstract: The present invention provides a semiconductor device including a plurality of wirings or conductive film patterns formed on a semiconductor substrate, and clearances are provided between the wirings or the conductive film patterns On a corner or an end part of at least one of the wirings or the conductive film patterns, protrusions are formed to protrude, facing the clearances between the wirings or the conductive film patterns Thereby, defects will not occur in the insulating protective film after an etching step for forming an aperture for exposing a bonding pad, and thus, a semiconductor device is manufactured without being subjected to an additional process that raises the manufacturing cost The present invention provides also a method of manufacturing the semiconductor device