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Journal ArticleDOI

Academic and industry research progress in germanium nanodevices

Ravi Pillarisetty
- 17 Nov 2011 - 
- Vol. 479, Iss: 7373, pp 324-328
TLDR
Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.
Abstract
Silicon has enabled the rise of the semiconductor electronics industry, but it was not the first material used in such devices. During the 1950s, just after the birth of the transistor, solid-state devices were almost exclusively manufactured from germanium. Today, one of the key ways to improve transistor performance is to increase charge-carrier mobility within the device channel. Motivated by this, the solid-state device research community is returning to investigating the high-mobility material germanium. Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.

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Citations
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Photoactive materials and devices for energy-efficient soft wearable optoelectronic systems

TL;DR: In this paper , the authors provide an overview of high-performance photovoltaic/photoemissive materials and devices and their applications to soft wearable energy-efficient optoelectronic systems.
Journal ArticleDOI

Electrically detected magnetic resonance study of the Ge dangling bonds at the Ge(111)/GeO2 interface after capping with Al2O3 layer

TL;DR: In this article, the electrical activity of Ge dangling bonds was investigated at the interface between GeO 2 -passivated Ge(1) substrate and Al 2 O 3 grown by atomic layer deposition, by means of electrically detected magnetic resonance spectroscopy.
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Optimal Oxide Passivation of Ge for Optoelectronics

TL;DR: In this paper, the behavior of minority conduction electrons and their associated traps is investigated in the context of minority carrier photonic devices, and the authors conclude that suboxides confer better passivation than a GeO2 interface, as determined by PL intensity.
References
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Proceedings ArticleDOI

A 90nm high volume manufacturing logic technology featuring novel 45nm gate length strained silicon CMOS transistors

TL;DR: In this article, the authors describe a novel strained transistor architecture which is incorporated into a 90nm logic technology on 300mm wafers, which features an epitaxially grown strained SiGe film embedded in the source drain regions.
Journal ArticleDOI

Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing

TL;DR: In this paper, a method of controlling threading dislocation densities in Ge on Si involving graded SiGe layers and chemical-mechanical polishing (CMP) is presented.
Journal ArticleDOI

High-k/Ge MOSFETs for future nanoelectronics

TL;DR: In this article, the opportunities and challenges of high-k/Ge MOSFETs are discussed on the basis of the material properties of Ge oxide to provide insights for future progress.
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