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Journal ArticleDOI

Academic and industry research progress in germanium nanodevices

Ravi Pillarisetty
- 17 Nov 2011 - 
- Vol. 479, Iss: 7373, pp 324-328
TLDR
Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.
Abstract
Silicon has enabled the rise of the semiconductor electronics industry, but it was not the first material used in such devices. During the 1950s, just after the birth of the transistor, solid-state devices were almost exclusively manufactured from germanium. Today, one of the key ways to improve transistor performance is to increase charge-carrier mobility within the device channel. Motivated by this, the solid-state device research community is returning to investigating the high-mobility material germanium. Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.

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Citations
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Advantage of (100)/ Oriented Channels in Biaxially- and Uniaxially Strained-Ge-On-Insulator pMOSFETs with NiGe Metal Source/Drain

TL;DR: In this paper, the authors compared current drivability between (001)/<;100> and (001/<;110> strained Ge-on-insulator pMOSFETs under biaxial and uniaxially stress.
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Simultaneous single-qubit driving of semiconductor spin qubits at the fault-tolerant threshold

TL;DR: In this article , single-qubit randomized benchmarking in a two-dimensional array of spin qubits, finding native gate fidelities as high as 99.992(1)%.
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Synthesis and characterization of Ge-core/a-Si-shell nanowires with conformal shell thickness deposited after gold removal for high-mobility p-channel field-effect transistors

TL;DR: In this paper, the conductance quantization in one-dimensional Ge-core/a-Si-shell nanowires at low temperatures was demonstrated for the first time, and the results indicated that the Ge-cores are multi-mode ballistic conductors with a mean free-path up to 500 nm.
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Direct-Bandgap Electroluminescence From Germanium With Subband Engineering Utilizing a Metal-Oxide-Semiconductor Structure

TL;DR: In this paper, an electrical doping method to realize the high n-type doping for a germanium (Ge) layer in a low-doped N-type Ge metal-oxide-semiconductor (MOS) structure in the accumulation condition is proposed, which maintains the initial crystal quality of Ge.
References
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Proceedings ArticleDOI

A 90nm high volume manufacturing logic technology featuring novel 45nm gate length strained silicon CMOS transistors

TL;DR: In this article, the authors describe a novel strained transistor architecture which is incorporated into a 90nm logic technology on 300mm wafers, which features an epitaxially grown strained SiGe film embedded in the source drain regions.
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Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing

TL;DR: In this paper, a method of controlling threading dislocation densities in Ge on Si involving graded SiGe layers and chemical-mechanical polishing (CMP) is presented.
Journal ArticleDOI

High-k/Ge MOSFETs for future nanoelectronics

TL;DR: In this article, the opportunities and challenges of high-k/Ge MOSFETs are discussed on the basis of the material properties of Ge oxide to provide insights for future progress.
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