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Journal ArticleDOI

Academic and industry research progress in germanium nanodevices

Ravi Pillarisetty
- 17 Nov 2011 - 
- Vol. 479, Iss: 7373, pp 324-328
TLDR
Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.
Abstract
Silicon has enabled the rise of the semiconductor electronics industry, but it was not the first material used in such devices. During the 1950s, just after the birth of the transistor, solid-state devices were almost exclusively manufactured from germanium. Today, one of the key ways to improve transistor performance is to increase charge-carrier mobility within the device channel. Motivated by this, the solid-state device research community is returning to investigating the high-mobility material germanium. Germanium-based transistors have the potential to operate at high speeds with low power requirements and might therefore be used in non-silicon-based semiconductor technology in the future.

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Citations
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Proceedings ArticleDOI

Novel processing for access resistance reduction in Germanium devices

TL;DR: In this paper, the experimental state-of-the-art in access resistance reduction in Ge devices is reviewed, highlighting in particular those techniques that have been applied to Si devices, but have not yet been properly optimized in Ge.
Journal ArticleDOI

Ex-situ doping of epitaxially grown Ge on Si by ion-implantation and pulsed laser melting

TL;DR: In this article, N-type doping of Ge layers epitaxially grown on Si by P ion-implantation and pulsed laser melting is reported, with or without a post-growth annealing cycle in order to reduce the amount of threading dislocations (TDs).
Journal ArticleDOI

The Limits of Electromechanical Coupling in Highly-Tensile Strained Germanium.

TL;DR: The electromechanical coupling of <111> Ge nanowires (NWs) is reported from unstrained conditions to the ultimate tensile strength, revealing the excellent prospects for utilizing strained Ge NWs in photodetector or piezoelectronic transistor applications, but significant challenges remain to realize strict direct bandgap devices.
Journal ArticleDOI

Theoretical prediction for growth behavior and electronic properties of monoanionic Ru2Gen− (n = 3–20) clusters

TL;DR: In this paper , a detailed theoretical study on the structural and electronic properties of monoanionic Ru2Gen− (n = 3-20) clusters using comprehensive genetic algorithm combined with density functional theory (CGA-DFT).
References
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Proceedings ArticleDOI

A 90nm high volume manufacturing logic technology featuring novel 45nm gate length strained silicon CMOS transistors

TL;DR: In this article, the authors describe a novel strained transistor architecture which is incorporated into a 90nm logic technology on 300mm wafers, which features an epitaxially grown strained SiGe film embedded in the source drain regions.
Journal ArticleDOI

Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing

TL;DR: In this paper, a method of controlling threading dislocation densities in Ge on Si involving graded SiGe layers and chemical-mechanical polishing (CMP) is presented.
Journal ArticleDOI

High-k/Ge MOSFETs for future nanoelectronics

TL;DR: In this article, the opportunities and challenges of high-k/Ge MOSFETs are discussed on the basis of the material properties of Ge oxide to provide insights for future progress.
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