STMicroelectronics

About: STMicroelectronics is a company organization based out in Geneva, Switzerland. It is known for research contribution in the topics: Signal & Transistor. The organization has 17172 authors who have published 29543 publications receiving 300766 citations. The organization is also known as: SGS-Thomson & STM.

Process for manufacturing a through insulated interconnection in a body of semiconductor material

Abstract: The process for manufacturing a through insulated interconnection is performed by forming, in a body of semiconductor material, a trench extending from the front (of the body for a thickness portion thereof; filling the trench with dielectric material; thinning the body starting from the rear until the trench, so as to form an insulated region surrounded by dielectric material; and forming a conductive region extending inside said insulated region between the front and the rear of the body and having a higher conductivity than the first body. The conductive region includes a metal region extending in an opening formed inside the insulated region or of a heavily doped semiconductor region, made prior to filling of the trench.

165-GHz Transceiver in SiGe Technology

Abstract: Two D-band transceivers, with and without amplifiers and static frequency divider, transmitting simultaneously in the 80-GHz and 160-GHz bands, are fabricated in SiGe HBT technology. The transceivers feature an 80-GHz quadrature Colpitts oscillator with differential outputs at 160 GHz, a double-balanced Gilbert-cell mixer, 170-GHz amplifiers and broadband 70-GHz to 180-GHz vertically stacked transformers for single-ended to differential conversion. For the transceiver with amplifiers and static frequency divider, which marks the highest level of integration above 100 GHz in silicon, the peak differential down-conversion gain is -3 dB for RF inputs at 165 GHz. The single-ended, 165-GHz transmitter output generates -3.5 dBm, while the 82.5-GHz differential output power is +2.5 dBm. This transceiver occupies 840 mum times 1365 mum, is biased from 3.3 V, and consumes 0.9 W. Two stand-alone 5-stage amplifiers, centered at 140 GHz and 170 GHz, were also fabricated showing 17 dB and 15 dB gain at 140 GHz and 170 GHz, respectively. The saturated output power of the amplifiers is +1 dBm at 130 GHz and 0 dBm at 165 GHz. All circuits were characterized over temperature up to 125degC. These results demonstrate for the first time the feasibility of SiGe BiCMOS technology for circuits in the 100-180-GHz range.

Microelectromechanical integrated sensor structure with rotary driving motion

Abstract: A driving mass of an integrated microelectromechanical structure is moved with a rotary motion about an axis of rotation, and a first sensing mass is connected to the driving mass via elastic supporting elements so as to perform a first detection movement in a presence of a first external stress. The driving mass is anchored to an anchorage arranged along the axis of rotation by elastic anchorage elements. An opening is provided within the driving mass and the first sensing mass is arranged within the opening. The elastic supporting and anchorage elements render the first sensing mass fixed to the driving mass in the rotary motion, and substantially decoupled from the driving mass in the first detection movement. A second sensing mass is connected to the driving mass so as to perform a second detection movement in a presence of a second external stress. A first movement is a rotation about an axis lying in a plane, and a second movement is a linear movement along an axis of the plane.

Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device

Abstract: In a substrate-level assembly (22), a device substrate (20) of semiconductor material has a top face (20a) and houses a first integrated device (1; 16), in particular provided with a buried cavity (3), formed within the device substrate (20), and with a membrane (4), suspended over the buried cavity (3) in the proximity of the top face (20a). A capping substrate (21) is coupled to the device substrate (20) above the top face (20a) so as to cover the first integrated device (1; 16), in such a manner that a first empty space (25) is provided above the membrane (4). Electrical-contact elements (28a, 28b) electrically connect the integrated device (1; 16) with the outside of the substrate-level assembly (22). In one embodiment, the device substrate (20) integrates at least a further integrated device (1', 10) provided with a respective membrane (4'); and a further empty space (25'), fluidically isolated from the first empty space (25), is provided over the respective membrane (4') of the further integrated device (1', 10).

Label-Free Detection of Tobramycin in Serum by Transmission-Localized Surface Plasmon Resonance

Abstract: In order to improve the efficacy and safety of treatments, drug dosage needs to be adjusted to the actual needs of each patient in a truly personalized medicine approach. Key for widespread dosage adjustment is the availability of point-of-care devices able to measure plasma drug concentration in a simple, automated, and cost-effective fashion. In the present work, we introduce and test a portable, palm-sized transmission-localized surface plasmon resonance (T-LSPR) setup, comprised of off-the-shelf components and coupled with DNA-based aptamers specific to the antibiotic tobramycin (467 Da). The core of the T-LSPR setup are aptamer-functionalized gold nanoislands (NIs) deposited on a glass slide covered with fluorine-doped tin oxide (FTO), which acts as a biosensor. The gold NIs exhibit localized plasmon resonance in the visible range matching the sensitivity of the complementary metal oxide semiconductor (CMOS) image sensor employed as a light detector. The combination of gold NIs on the FTO substrate, ...