STMicroelectronics

About: STMicroelectronics is a company organization based out in Geneva, Switzerland. It is known for research contribution in the topics: Signal & Transistor. The organization has 17172 authors who have published 29543 publications receiving 300766 citations. The organization is also known as: SGS-Thomson & STM.

A Saliency-Based Convolutional Neural Network for Table and Chart Detection in Digitized Documents

Abstract: Within the realm of information extraction from documents, detection of tables and charts is particularly needed as they contain a visual summary of the most valuable information contained in a document. For a complete automation of the visual information extraction process from tables and charts, it is necessary to develop techniques that localize them and identify precisely their boundaries. In this paper we aim at solving the table/chart detection task through an approach that combines deep convolutional neural networks, graphical models and saliency concepts. In particular, we propose a saliency-based fully-convolutional neural network performing multi-scale reasoning on visual cues followed by a fully-connected conditional random field (CRF) for localizing tables and charts in digital/digitized documents. Performance analysis, carried out on an extended version of the ICDAR 2013 (with annotated charts as well as tables) dataset, shows that our approach yields promising results, outperforming existing models.

Apparatus and method for indexing MPEG video data to perform special mode playback in a digital video recorder and indexed signal associated therewith

Abstract: There is disclosed an apparatus for implementing special mode playback operations in a digital video recorder. The apparatus comprises an Intra frame indexing device capable of receiving an incoming MPEG video stream and identifying therein data packets associated with Intra frames, wherein the Intra frame indexing device modifies header information in a first data packet associated with a first Intra frame to include location information identifying a storage address of a second data packet associated with a second Intra frame.

Ball grid array integrated circuit package with high thermal conductivity

Abstract: An integrated circuit package with a path of high thermal conductivity is disclosed. A thermally conductive slug, formed of a material such as copper, is attached to an underside portion of a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed. An integrated circuit chip is mounted to one side of the slug exposed in the opening. An opposing surface of the slug lies below the plane of the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to a portion of the underside of the substrate not covered by the slug in a ball-grid-array manner, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.

Safety device against the unauthorized detection of protected data

Abstract: The disclosure concerns the safety of the confidential information contained in integrated circuits. In a certain number of integrated circuit applications and, more particularly, in the circuits contained in cards known as "chip cards", it is necessary to prohibit access by unauthorized persons to confidential information stored in a memory of the circuit. To prevent the fraudulent practice of examining the current consumption at the terminals of the integrated circuit during an operation of reading or writing in the memory, a protection circuit is used. This protection circuit actuates the simulation, according to a pseudo-random sequence generated by a generator, of current consumption values identical to those of real memory cells.