Freescale Semiconductor

About: Freescale Semiconductor is a based out in . It is known for research contribution in the topics: Layer (electronics) & Signal. The organization has 7673 authors who have published 10781 publications receiving 149123 citations. The organization is also known as: Freescale Semiconductor, Inc..

Method for forming bumps on a substrate

Abstract: Solder bumps are formed on a substrate, such as a semiconductor die (28) or wafer, using a screen printing and reflow operation. Solder paste (18) is screened into openings (14) of a stencil (10). The paste is reflowed within the stencil to produce a solder preform (22). The stencil and solder preforms are then aligned over the substrate to be bumped so that the preform aligns with a metal pad (30) on the substrate. The solder preforms are again reflowed, and the solder within the openings of the stencil is drawn onto the metal pad. To facilitate the transfer of the solder from the stencil to the metal pad, a second stencil (12) can be used to form a protrusion (27) on the solder preform. The protrusion contacts the metal pad during the transfer reflow operation to facilitate removing the solder from the stencil.

Method and apparatus for moving data in a parallel processor

Abstract: A method and apparatus for moving data in a parallel processing system (3). In one embodiment, a single instruction accesses one significant bit of information from each element in processing element array (80) and combines these bits into one designated element in global register file (50). The ordering of bits in vectors of global register file (50) associates each bit with an element of processing element array (80). Another single instruction distinguishes significant bit information from a particular vector in global register file (50) and transfers that information to an associated bit in storage circuits associated with each element in processing element array (80).

Packaged integrated circuit with enhanced thermal dissipation

Abstract: A semiconductor package (10) uses a plurality of thermal conductors (56-64) that extend upward within an encapsulant (16) from one or more thermal bond pads (22, 24, 26) on a die (14) to disperse heat. The thermal conductors may be bond wires or conductive stud bumps and do not extend beyond a lateral edge of the die. One or more of the thermal conductors may be looped within the encapsulant and exposed at an upper surface of the encapsulant. In one form a heat spreader (68) is placed overlying the encapsulant for further heat removal. In another form the heat spreader functions as a power or ground terminal directly to points interior to the die via the thermal conductors. Active bond pads may be placed exclusively along the die's periphery or also included within the interior of the die.

Transient detection circuit

Abstract: A transient detection circuit which may be used in an electrostatic discharge (ESD) clamp circuit. The transient detection circuit includes a filter circuit and an inverter circuit. The voltage switch point of the inverter circuit has a constant voltage offset from one of the nodes. When a filtered voltage level from the filter circuit crosses the voltage switch point of the inverter circuit (indicative of an ESD event), the inverter circuit provides a signal indicating an ESD event.

Encapsulated electronic component having a heat diffusing layer

Abstract: An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.